Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …

2024 Semi Industry Forum: GenAI + Semiconductors + Humanity

Computer History Museum, Mountain View, CA

GenAI + Semiconductors + Humanity: History in the Making From 5:15 until 6pm, Silicon Catalyst has arranged special access for Forum attendees only to the Museum exhibition area (ground floor) The world we live in is at a major inflection point, as the symbiotic relationship between generative AI and semiconductors will impact society for generations …

Supercomputing 2024 (SC24)

Georgia World Congress Center 285 Andrew Young International Blvd NW, Atlanta, GA, United States

Program Each year, SC provides the leading technical program for professionals and students in the HPC community, as measured by impact, at the highest academic and professional standards. The Program is designed to share best practices in areas such as: algorithms; applications; architectures and networks; clouds and distributed computing; data analytics, visualization, and storage; machine …

Workshop on Open-Source EDA Technology (WOSET)

Online

Workshop on Open-Source EDA Technology The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will (virtually) bring together EDA researchers who are committed to open-source principles to share their experiences and coordinate efforts towards developing a reliable, fully open-source EDA flow. The workshop will feature presentations that overview existing or under-development open-source …

Defect-Based Testing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF model is a poor model for defects. Other models and strategies are required to catch …

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

Online

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have …