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In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly …
WHERE INNOVATION MEETS INFRASTRUCTURE Experience the world's largest gathering of data centre professionals and end-users at Data Centre World Frankfurt on 22-23 May 2024 at Messe Frankfurt. Data centres are the beating heart of the digital economy. Now it's time to take part in the event that powers the digital economy. Why Attend Data Centre World Frankfurt invites …
ASIP Designer enables the creation of custom vector DSPs for AI Wednesday, May 22, 2024 4:00 - 6:00 pm CEST / 7:00 - 9:00 am PT Case Studies accelerating AI applications using custom RISC-V based SIMD/VLIW DSPs The revolution in AI triggers an increased awareness for application-specific instruction-set processors (ASIPs). These processors implement a specialized …
In 2021 Siemens EDA released CDC Assist. CDC Assist is an ML powered feature that empowers users to configure, debug, and close CDC on designs more rapidly. Following the success of CDC Assist, Siemens introduced RDC Assist in 2023. Using the same ML technology in CDC Assist, RDC Assist dramatically improves the time and effort …
Manufacturing issues can be a big reason why your project timelines get derailed and even result in costly failures. By understanding common errors that occur while designing or creating your fabrication and assembly documentation, you can avoid making the same mistakes on future designs. With access to over 80 comprehensive Design for Test (DFT), Design …
Ever wondered how light travels within a device? This Rand Simulation webinar will be your guide to understanding and designing optical lightguides using Ansys SPEOS. We'll explain the fundamentals of …