New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing …
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation …
**Work Email Required for Registration** Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance. This includes requirements, architecture, implementation, verification, hardware bring-up, firmware, and customer documentation. Local correctness does not guarantee lifecycle coherence. llmda.ai believes that consistency itself should …
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About this event The Inference Stack Can Talk. Learn How to Listen. AI has entered the inference era. For years the industry focused on training models. But today the real challenge is running AI workloads in production at scale. In this webinar, you’ll have the opportunity to learn how to decode the signals from your inference stack and turn them into smarter infrastructure …
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Themed Heterogeneous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging …
About this event This webinar showcases how the Keysight Technologies SOS extension integrates design data management directly into Visual Studio Code, helping digital design and verification teams streamline RTL and HDL workflows without leaving their coding environment. Who should attend this event? Digital design engineers writing RTL in SystemVerilog, Verilog, or VHDL who use VS Code …
CONFERENCE & EXHIBITION HPC, AI, Quantum: Powering Innovation and Sustainability ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies, as well as what lies ahead. Additionally, we are committed to sustainability by promoting energy-efficient …
Verification Futures UK 2026, co-located with Semiconductors Futures 2026 organised by Tessolve and co-organised this year with Alpinum. The conference continues its strong tradition of delivering a unique blend of conference presentations, exhibitions, training, and industry networking sessions focused on the challenges faced in hardware and software verification. The event remains an important forum for …
CEA-Leti’s flagship event Discover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026. Join industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare, automotive, industrial, defense, and consumer-electronics sectors. Leave with confidence in the possible. REGISTER HERE
About this event This webinar shows how engineers can use a unified EOE simulation workflow in Keysight Advanced Design System (ADS) to co-design and validate high-speed Ethernet systems across both electronic and photonic domains for faster, more accurate development. Who should attend this event? Signal integrity engineers working on high-speed Ethernet links, Photonic design engineers …
Join us for our 6th Annual Virtual Prototyping Day and learn how you can "shift left" your development cycle with virtual prototypes. Highly complex SoC and muti-die designs are putting pressure on silicon and software development teams to meet time-to-market demands. Virtual prototypes are the answer to begin development earlier, reduce costs, collaborate across teams, and …
Date: Jun 25, 2026 | 9:00 AM PST In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys 3DIC Compiler platform that spans early planning through signoff. The webinar …
Join us to get the latest on: TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
About this event Engineering at the Edge Webinar Series - Episode 4 As semiconductor complexity increases and board designs become denser, manufacturing teams face tighter tolerances, reduced test access, and rising pressure to maintain yield and throughput. Validating RF performance and high-speed digital signal integrity at production scale adds a new layer of complexity that …
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Tutorial Abstract Since the invention of the 1T1C bit cell more than 50 years ago, DRAMs have become the main memory of choice for processors in computing systems and consumer electronics devices. As new computing paradigms have been created, including AI, 3D graphics, HPC, cloud computing, and smart phones, specialized processors and DRAM memories have …
The International Symposium on Computer Architecture (ISCA) is the premier forum for new ideas and experimental results in computer architecture. The conference specifically seeks particularly forward-looking and novel submissions. In 2026, the 53rd edition of ISCA will be held in Raleigh at the Raleigh Convention Center from June 27 to July 1, 2026. REGISTER HERE
Overview The AVS 26th International Conference on Atomic Layer Deposition (ALD 2026) featuring the 13th International Atomic Layer Etching Workshop (ALE 2026) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe …
Join us in 2026 We are ready to deliver more 1,800+ attendees. Join our community of users, industry experts and trusted partners. Realize LIVE offers something for everyone! 350+ sessions. Explore breakout sessions, technical tracks, trainings and more. More than 60% of sessions were led by customers, sharing real-world insights. 90% overall satisfaction rate. Realize LIVE …
Welcome to SMACD 2026 International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design REGISTER HERE
Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
About this event Join our upcoming webinar to discover how VisionSym transforms CAD models into photorealistic images using LightTools or LucidShape—eliminating the need for physical prototypes. With GPU-accelerated ray tracing and photometrically accurate simulations, VisionSym enables both design verification and visual appearance evaluation in one streamlined workflow. In this session, you’ll learn how to: Validate designs against …
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About this event This discovery training introduces ImSym – Imaging System Simulator, an advanced platform for end-to-end imaging system simulation. ImSym allows engineers to virtually prototype imaging systems by modeling the full image formation pipeline, from scene and optics through the detector and image signal processing. This enables earlier insight into real-world image performance and …
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Join us at CadenceCONNECT: Tech Days Europe 2026, our annual, free, multi-track event dedicated to the engineers, innovators, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows, boosting productivity, and enabling breakthroughs across every domain. REGISTER HERE
Join us to get the latest on: TSMC's industry-leading HPC, Smartphones, IoT, and Automotive platform solutions TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™ TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, …
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts driven by the growing demand for AI …
International Test Conference is the world's premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. At IEEE ITC India, design, test, and yield professionals can confront …
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About this event Join us for our annual LucidShape User Group Meeting— This year’s meeting brings together the LucidShape community for a day of insights, innovation, and collaboration. Whether you're focused on automotive lighting, simulation workflows, or advanced design techniques, you’ll gain practical knowledge you can apply right away. What You’ll Experience Latest LucidShape Innovations …
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The Long Beach Convention Center will serve as a dynamic venue for DAC 2026: The Chips to Systems Conference. Set along the scenic Southern California coastline, the center offers modern meeting spaces and a vibrant setting that reflects the innovative spirit of DAC. Its central location in downtown Long Beach provides easy access to hotels, …
Where your digital transformation gets real — fast We are excited to be visiting a new city with the Realize LIVE digital transformation conference to showcase artifial intelligence, digitalization, sustainability and optimization across the product lifecycle. Learn, network and connect with the Siemens software community, and walk away with new tools and insights for your …
What is FMS? Our over-arching mission is to help accelerate the move towards a world where advanced memory and storage technologies enable AI systems, data centers, hyperscalers and enterprises to operate at unprecedented scale, speed and efficiency. All the while supporting the engineers and architects building the infrastructure of the future. FUTURE OF MEMORY & …
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Join us on August 12 for CadenceLIVE India 2026, where Cadence technology users connect with the engineers and industry leaders who develop the solutions and the industry experts who influence market trends. Participants experience a day of learning, connection, and cutting-edge technology shaping the future of electronic design and intelligent systems. This premier event brings …
The 35th USENIX Security Symposium will take place on August 12–14, 2026, at the Baltimore Marriott Waterfront in Baltimore, MD, USA. The USENIX Security Symposium brings together researchers, practitioners, system programmers, and others interested in the latest advances in the security and privacy of computer systems and networks. The full symposium program will be available soon; view …
Welcome to the 33rd iteration of the IEEE Hot Interconnects symposium. HotI’2026 will be held virtually. 2026 Conference Theme Scale-Up, Scale-Out, Scale-Across: Do they really differ? Complex high-capacity training and disaggregated inference workloads are being scaled-across multiple sites, blurring the lines between contemporary scale-out and scale-up interconnection stacks. All the classical issues, such as jitter, …
Hot Chips 2026 will be held Sunday, August 23 - Tuesday, August 25, 2026 at Memorial Auditorium, Stanford, Palo Alto, CA. Early registration is now open; register by Friday, July 31, 2026, for the best rate. About Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences …
Join your colleagues in San Diego for the latest research and insights. You’re invited to explore the latest advances and breakthroughs at this dynamic annual conference taking place in beautiful Southern California. Connect with leading researchers and scientists as they share new work in optical engineering, nanotechnology, quantum science, and organic photonics. Meet with top …
SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing …
Join your colleagues in Monterey for the premier worldwide photomask conference We invite you to explore the latest advances and breakthroughs at this annual conference in Monterey, California. Connect with leading scientists and engineers and discover new work across photomasks, patterning, metrology, materials, inspection and repair, mask business, extreme ultraviolet lithography, and emerging technologies. Connect …
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What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Our 4 track event is divided into Hardware & Systems, Edge AI Infrastructure, Enterprise AI, …
SEMICON India 2026 will be held from September 17–19, 2026, at Yashobhoomi (India International Convention & Expo Centre), New Delhi, bringing together the global semiconductor ecosystem on one powerful platform. Jointly organized by the India Semiconductor Mission (ISM) and SEMI, the event reflects India’s growing prominence as a trusted partner in the global semiconductor value chain. Under the visionary leadership of Hon’ble Prime …
A Strategic Platform for Industry Leaders The Third Edition of the Global Photonics Economic Forum will convene September 24 - 25 in Malaga, Spain. Building on the success of the 2024 and 2025 edition this year the forum will focus on defining and sharing joint strategies to tackle the current volatile geopolitical landscape. Global photonics and semiconductor industries …
The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging …
Microelectronics UK brings together engineers, technical leaders and technology providers from across the microelectronics ecosystem — spanning semiconductors, photonics and embedded systems — for two days of technical insight, collaboration and commercial connection. Following a strong 2025 edition, the event showcases the UK's world-class capabilities in R&D, design innovation and advanced manufacturing, while connecting the …
International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how …
Where the Global Microelectronics Industry Connects, Innovates, and Leads October 13–15, 2026 | Moscone Center | San Francisco, CA SEMICON West returns to San Francisco, bringing together the world’s leading semiconductor companies, technology innovators, policymakers, engineers, researchers, and business leaders driving the future of microelectronics. From AI and advanced packaging to smart manufacturing, sustainability, mobility, …
ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …
59th IEEE/ACM International Symposium on Microarchitecture The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. …
Scaling integrated photonics for global impact Photonic Integrated Circuits (PICs) are entering commercial deployment, high-volume manufacturing, and critical applications in markets such as data and telecom. PIC Summit Europe 2026 reflects this shift. Discussions move beyond technology potential to address what is required to deliver PICs at scale, from advanced packaging and testing to yield, …
About User2User Mid-Atlantic User2User Mid-Atlantic is focused around these areas: Printed circuit board design (PCB) and design for manufacturing PCB simulation Application specific integrated circuit and field programmable gate array: advanced functional verification Calibre design Why attend User2User Mid-Atlantic 2026? Learn Peer-delivered technical sessions will cover a wide range of topics, so you can explore …
Call for Papers Jointly sponsored by IEEE and ACM, IEEE/ACM ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. IEEE/ACM ICCAD covers the full range of CAD topics – from device and circuit level up through system level, as well …
electronica—Empowering the All Electric Society Every two years, the world of electronics meets at electronica in Munich, Germany. As the world's leading trade fair, it showcases the full range of technologies, products, and solutions that are empowering an All Electric Society (AES). Practice-oriented forums and the world-class electronica Automotive Conference provide in-depth insights into the …
Europe's Next Era: Navigating the Perfect Storm SEMICON Europa 2026 is co-located with electronica, with a theme that centers on the increasingly interconnected relationship between technological innovation and the shifting geopolitical landscape. As global dynamics grow more complex, Europe faces both new, unprecedented challenges and unprecedented opportunities that will define its strategic position for decades to …
December 3, 2026 - December 4, 2026 More information on SEMIEXPO Viet Nam will be available in Q3 2026 Location Ho Chi Minh City Vietnam REGISTER HERE
We encourage the following individuals to attend and participate SEMICON Japan We look forward to seeing everyone interested in semiconductor and electronics technology and industry. Device manufacturers and OSAT engineers who are considering the latest manufacturing technologies and products System manufacturers who want to learn about trends in cutting-edge electronics Managers and investors who want to know about …
The Leading Conference in Electron Devices For over 65 years, the IEEE International Electron Devices Meeting has been the premier forum for presenting breakthroughs in semiconductor devices, device physics, process technologies, and emerging computing architectures. Researchers from academia, industry, and government gather annually to share innovations shaping the future of electronics. REGISTER HERE
