Optical Solutions User Conference

800 N Mary Ave 800 N Mary Ave, Sunnyvale, CA, United States

Learn, Network, and Accelerate Optical Design Innovation For this year’s event, we are excited to be discussing the latest in optical design and simulation, including topics on image simulation with the entire image chain, freeform optics, display technnology, high-performance computing for photonic devices, and other applications using the Optical Solutions suite of tools. More details …

Webinar: Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus

Online

Join us for an insightful webinar series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such …

Webinar: Automated AFM for Inline Hybrid Bonding Metrology in the Semiconductor Industry

Online

Webinar Summary In this webinar, we will illustrate how Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps, and its suitability for labs and fabs working on new bonding device design. The following topics will be discussed: Key Automated AFM features for process control in high volume …

2024 SIA Awards Dinner

Signia by Hilton San Jose 170 S Market St, San Jose, CA, United States

Date: Nov. 21, 2024 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose 170 S Market St San Jose, Calif.95113 REGISTER HERE

Wafer Fab Processing

Munich, Germany

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …

Failure and Yield Analysis

Munich, Germany

Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …

SemIsrael Expo 2024

Avenue Convention Center Airport City, Israel

Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …

Substrate Vision Summit

Hilton Santa Clara 4949 Great America Pkwy, Santa Clara, CA, United States

Substrate Vision Summit, organized by Soitec, gathers leading engineers and industry professionals to explore the cutting-edge developments in semiconductor materials that are shaping the future of technology. This event provides …

ICCAD Expo 2024

Shanghai, China Shanghai, China

About ICCAD-Expo In the development of China's integrated circuit design industry, the China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has been playing an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends. Since its establishment in 1994, ICCAD-Expo  has been successfully held for 29 sessions in Shenzhen, Hangzhou, Chengdu, Wuhan, Shanghai, Zhuhai, Dalian, …

SEMICON Japan 2024

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). REGISTER HERE

Webinar – Glass Interposers and Substrates for Advanced Packaging: An Overview of Competitor Patenting Activities

Online

Details For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic or ceramic core substrates for high-performance computing (HPC) and artificial intelligence (AI) applications. …

CES 2025

Las Vegas, NV

Why CES? CES® unites the brightest tech luminaries to pioneer the future and solve the world's biggest problems. This is where brands get business done, meet new partners and where the industry’s sharpest minds take the stage to unveil their latest releases and boldest breakthroughs. Register today for CES 2025. The world’s most powerful tech …