One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of the future. To further this vision, this year’s show—held in collaboration and concurrently with CEATEC 2024, Japan’s largest digital exhibition of its IT and electronic …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and Modeling Accurately accounting for noise is essential for ensuring reliability of complex semiconductor devices. Explore how noise data across the wafer serves as an early …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter extraction, and model quality checking. With its flexible GUI and flow control capabilities, SDEP™ enables modeling engineers to efficiently build and customize workflows, automate routine …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety Conference into a larger cross- functional event. It is free to attend offers leading keynotes, customer-led technical sessions on the first conference day and technical …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …
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The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on enriching their interactions with this technology. This event offers an enabling environment for the exchange of ideas, the creation of professional networks and the exploration …
RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive. data center, space, IoT, embedded and more. Each day, thousands of engineers around the world collaborate and contribute to advance RISC-V. The RISC-V community shares the …
About It’s time for our annual CadenceCONNECT: Jasper User Group Conference - San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. This is an in-person conference. The Jasper User …
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Become part of a global network of engineers developing innovative approaches and solutions that are shaping the future of the transportation industry! This two-day conference is free to attend and offers technical sessions and hands-on workshops. Registering for either or both conferences will allow you to access and attend any session. To register for the …
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WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand. New for 2024, EDI CON Educational Days will …
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Join this webinar to learn how to engage students in how tech solutions such as smog towers can contribute to a more sustainable future. Learn how the already created education resources can support easy implementation into your curriculum while retaining, engaging, and teaching your students about industry-standard tools. TIME: October 23, 2024 11 AM EDT …
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