Book your conference ticket to Digital Transformation Week Europe which is set to explore what’s new and worth attention in the Digital Transformation ecosystem. Learn more: https://digitaltransformation-week.com/europe/ Join us in-person …
ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features …
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EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is …
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We will introduce all the physics and system design that simulation can support when designing wind turbines. Learn how to engage students in engineering and design challenges and enhance their understanding of industrial aerodynamics, specifically wind engineering. TIME: October 3, 2024 11:00 AM EDT Venue: Virtual Overview Wind energy is one of the best sectors …
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One of the main draws of digital engineering to enable true digital transformation is using connected digital models to provide timely contextual engineering insight for decision-making. The new 2024 R2 versions of Ansys Minerva, ModelCenter, and STK take the idea of connectedness to the next level. These new features will enable Ansys ModelCenter and STK …
The 2024 Leaders in Simulation Summit Great ideas begin with people like you. Having the right solution at the right time can mean the difference between tabling thoughts or transforming industries. Ansys technologies puts the power of innovation in your hands. Step into the future of engineering at the Simulation Leaders Summit, where we celebrate …
Processor trace gives software developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. In this presentation, Siemens and Lauterbach will give an overview of how processor trace can be used to improve embedded software and applications. We will explain the RISC-V Efficient Trace (E-trace) specification and cover the …
Employing innovative adaptive dual-solver technology, NanoSpice Pro X™ integrates the cutting-edge FastSPICE engine with the analog engine to deliver high accuracy and performance for memory circuits, CPUs, custom digital designs, SoCs, and full-chip mixed-signal applications. Featuring breakthrough capabilities like intelligent topology recognition, automated partitioning, and enhanced event-driven architecture. NanoSpice Pro X™ excels in RC reduction …
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This Ansys-hosted event focuses on the transformative impact of artificial intelligence and advanced engineering methods on the region's industries. Attendees will learn about our cutting-edge AI technologies, innovative engineering practices, and how AI will shape the future of industry/engineering. Date: Thursday, October 10, 2024 Time: 9:30 AM – 3:30 PM ET (HH 4:00 PM – 6:00 PM) Venue: 850 …
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The Design and Verification Conference in Europe (DVCon Europe) is the leading European event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. Sponsored by Accellera Systems Initiative, DVCon Europe brings chip architects, design and verification engineers, and IP integrators the latest methodologies, techniques, …
From Ideas to Impact The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From …
Last year the 70 year-old Tokyo Motor Show was reborn as the Japan Mobility Show, conceived to promote collaboration across industries through new partnerships working to create the mobility of the future. To further this vision, this year’s show—held in collaboration and concurrently with CEATEC 2024, Japan’s largest digital exhibition of its IT and electronic …
Join Keysight for a comprehensive session focused on enhancing device reliability and preventing costly silicon respins through innovative noise and binning modeling technologies. Enhancing Reliability with Accurate Noise Measurement and …
SDEP™ provides robust APIs for creating automated reusable modeling flows significantly reducing turnaround time while preserving essential device modeling knowledge. The platform integrates Primarius‘ latest technologies for data analysis, parameter …
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Become part of a European network of engineers developing innovative approaches and solutions shaping the future. The Ansys Innovation Conference, Germany brings together the renowned LS-DYNA forum and Digital Safety …
This Summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast. The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in …
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The 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 at 𝗠𝗮𝗱𝗿𝗶𝗱 is an exclusive event where every engineer, researcher or scientist who uses or is interested in numerical simulation will find a unique experience focused on …
