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Multiple Sessions - All English Language: 14:00 JST (APAC) 10:00 EDT, 16:00 CET (AMER and EUR) Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and …
The GSA European Executive Forum is our flagship event in Europe which, over two days, always attracts the very top speakers and attendees: 300 senior decision makers, the majority VP and C-level profiles. Over the past 20 years, it has become the reference executive event for the semiconductor industry in the EMEA region. This year, …
Forum am Schlosspark
Stuttgarter Str. 33, Ludwigsburg
We are excited to announce the 28th Automobil-Elektronik Kongress, set to take place on June 18 and 19, 2024 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. The focus topics for the 2024 conference will include discussions on: …
Helping students understand the underlying physics that connects antenna performance, array implementation, and prediction of its behavior is featured in this upcoming webinar on Ansys Electronics Desktop. TIME: JUNE 18, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST Venue: Virtual Overview Electromagnetic phenomena in antennas are often at the core of …
Helping students understand the underlying physics that connects antenna performance, array implementation, and prediction of its behavior is featured in this upcoming webinar on Ansys Electronics Desktop. TIME: JUNE 18, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST Venue: Virtual Overview Electromagnetic phenomena in antennas are often at the core of …
This webinar will demonstrate how Ansys tools can improve PCB designs for higher performance and reliability. Ansys Maxwell simulates low-frequency (LF) EM fields to identify potential EMI/EMC issues for shielding and grounding purposes. Engineers can also predict electric currents distributed throughout the PCB power traces and study the EM forces generated by the magnetic field …