Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade. At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More
US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight
TSMC drew the ire of Chinese state media last week after it complied with the US Department of Commerce request to submit supply chain data by the November 8 deadline.
The Chinese reports, which called it an act of “surrender” to US hegemony, were careful in laying blame on Taipei for caving in to Washington, rather than pointing fingers… Read More
Taiwan Semiconductor Outlook May 1988
This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company
Given… Read More
Update on TSMC’s 3D Fabric Technology
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
Overview of 3D Fabric
The TSMC… Read More
On-Chip Sensors Discussed at TSMC OIP
TSMC recently held their Open Innovation Platform (OIP) Ecosystem Forum event where many of their key partners presented on their latest projects and developments. This year one of their top IP provider partners, Analog Bits, gave two presentations. Analog building blocks have always been necessary as enabling technology … Read More
Design Technology Co-Optimization for TSMC’s N3HPC Process
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
One of the topics that L.C. … Read More
Highlights of the TSMC Open Innovation Platform Ecosystem Forum
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum. The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC. This article summarizes the highlights of the TSMC keynote from… Read More
TSMC Arizona Fab Cost Revisited
Back in May of 2020 I published some comparisons of the cost to run a TSMC fab in Arizona versus their fabs in Taiwan. I found the fab operating cost based on the country-to-country difference to only be 3.4% higher in the US and then I found an additional 3.8% because of the smaller fab scale. Since that time, I have continued to encounter… Read More
Podcast EP39: The History of TSMC with Dr. Walden Rhines
Dan is joined by Dr. Walden Rhines for a far-reaching discussion of the history of TSMC and the foundry business model. The past, present and potential future scenarios are all explored.
https://en.wikipedia.org/wiki/Wally_Rhines
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker,… Read More
Podcast EP38: Semianalysis on Intel GF TSMC and the Foundry Business
Dan is joined by Dylan Patel of Semianalysis.com covering Intel, GF, TSMC, the semiconductor shortage and more. This is a candid discussion between analysts on current semiconductor events.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the… Read More