100X800 Banner (1)
WP_Term Object
(
    [term_id] => 386
    [name] => Semiconductor Services
    [slug] => semiconductor-services
    [term_group] => 0
    [term_taxonomy_id] => 386
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1168
    [filter] => raw
    [cat_ID] => 386
    [category_count] => 1168
    [category_description] => 
    [cat_name] => Semiconductor Services
    [category_nicename] => semiconductor-services
    [category_parent] => 0
    [is_post] => 
)

Alphawave IP and the Evolution of the ASIC Business

Alphawave IP and the Evolution of the ASIC Business
by Daniel Nenni on 03-21-2022 at 6:00 am

Alphawave IP OpenFive

Alphawave IP has agreed to acquire OpenFive, a SiFive business unit (formerly Open-Silicon) for $210m in cash. Having spent many years in the ASIC business which included working with Open-Silicon, Alphawave, and OpenFive here is my perspective on the acquisition:

This acquisition accomplishes two things: First it trims down… Read More


CEO Interview: Aki Fujimura of D2S

CEO Interview: Aki Fujimura of D2S
by Daniel Nenni on 03-18-2022 at 6:00 am

ESD Alliance D2S Blog Post Image 1 1

Curvilinear Design Primer for Design, Packaging Communities

This interview was done by Bob Smith, Executive Director, ESD Alliance, a SEMI Technology Community.

Previously, Fujimura served as CTO at Cadence Design Systems and returned to Cadence for the second time through the acquisition of Simplex Solutions where he was… Read More


Semiconductor Packaging History and Primer

Semiconductor Packaging History and Primer
by Doug O'Laughlin on 03-09-2022 at 10:00 am

https3A2F2Fbucketeer e05bbc84 baa3 437e 9518 adb32be77984.s3.amazonaws.com2Fpublic2Fimages2F56e012ca 2cf7 4b4e b605 e8c008265eb8 1604x1109

From DIP to Advanced, semiconductor packaging has become strategic

For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek

Read More

Semiconductor Capital Equipment Series: Introduction

Semiconductor Capital Equipment Series: Introduction
by Doug O'Laughlin on 03-06-2022 at 10:00 am

Semiconductor Capital Equipment Series 1

Semicap is in some ways the unsung hero of American global dominance in semiconductors. The US punches above its weight in terms of market share compared to demand, but specifically in three categories. EDA, IP, and Equipment.

I hope to write about everything there can be said about semiconductors, and EDA is a place I understand… Read More


Integrating Materials Solutions with Alex Yoon of Intermolecular

Integrating Materials Solutions with Alex Yoon of Intermolecular
by Daniel Nenni on 03-04-2022 at 6:00 am

6 Alex Yoon headshots small

I had a follow-on discussion with Alex Yoon from our podcast last year.  He is as a Head of Strategic and Emerging Technologies and partnerships at Intermolecular, part of EMD electronics.

Prior to joining EMD electronics, he was Senior Technical Director at Lam Research, led activities in emerging memory and novel materials … Read More


Passion for Innovation – an Interview with Samtec’s Keith Guetig

Passion for Innovation – an Interview with Samtec’s Keith Guetig
by Mike Gianfagna on 03-03-2022 at 6:00 am

Keith Guetig

There’s a lot to be said for staying power. I’ve met many people in my career who simply resonate with a company – their products, culture, and direction. People like this build an organic knowledge of the company’s products and its customers. They contribute to a culture that helps enable great companies. Keith Guetig is one such… Read More


Sondrel explains the 10 steps to model and design a complex SoC

Sondrel explains the 10 steps to model and design a complex SoC
by Daniel Nenni on 03-02-2022 at 10:00 am

clip image002

Sondrel just released a position paper on how to model and design a complex ASIC. We have been following Sondrel for the past year and I have found their collateral to be excellent. Here is the position paper overview, a description of the new Sondrel modeling tool, the 10 steps, and of course a link to download the paper:

Overview
It… Read More


Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering

Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering
by Daniel Nenni on 02-28-2022 at 6:00 am

SystemUVM Language Characteristics

The much anticipated (virtual) DVCON 2022 is happening this week and functional verification plus UVM is a very hot topic.  Functional Verification Engineers using UVM can enjoy a large number of benefits by synthesizing test content for their testbenches. Abstract, easily composable models, coverage-driven content, deep… Read More


Intel’s Investor Day – Nothing New

Intel’s Investor Day – Nothing New
by Doug O'Laughlin on 02-27-2022 at 6:00 am

https3A2F2Fbucketeer e05bbc84 baa3 437e 9518 adb32be77984.s3.amazonaws.com2Fpublic2Fimages2Fbe32664a cc3a 41e2 8898 d1a1ba57daf1 2400x1240

Intel’s big investor day was anything but big. The stock reacted poorly, down 5% on a day that was a widespread sell-off anyways.

I want to briefly summarize what matters for the stock. There was very little incremental news to the technology roadmap, and the financial outlook was underwhelming, to say the least.

The revenue guide… Read More


Intel 2022 Investor Meeting

Intel 2022 Investor Meeting
by Scotten Jones on 02-21-2022 at 6:00 am

Figure 1 Process Innovations

Last Thursday Intel held their investors meeting, in this write up I wanted to focus on my areas of coverage/expertise, process technology and manufacturing.

Technology Development presented by Ann Kelleher

Last year Intel presented their Intel Accelerated plan and, in this meeting, we got a review of where Intel stands on that… Read More