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The first keynote at the Burlingame 3D conference was by Doug Yu of TSMC. Not surprisingly he was talking about 3D. In particular, TSMC has WLSI technology that they call CoWoS, which stands for chip-on-wafer-on-substrate which pretty much describes how it is built. This is the technology that Xilinx uses for its recently announced… Read More
QCOM is now sampling the TSMC 20nm version of its market dominating Gobi LTE modem. The announcement also included a new turbo charged version of their 28nm Snapdragon 800 SoC with a Krait 450 quad core CPU and Adrino 420 GPU. Given the comparable benchmarks between the Intel 22nm SoC and the 28nm SoCs from Apple and QCOM, the new 20nm… Read More
It is important to note that the System On Chip (SoC) revolution that is currently driving mobile electronics has one very important enabling technology and that is Semiconductor Intellectual Property. Where would we be without the commercial IP market segment? Computers and phones would still be on our desks for one thing, and… Read More
Taiwan Semiconductor Manufacturing Corporation is the world’s leading semiconductor foundry by revenue and, by extension, profitability. While I am deeply saddened that current CEO Morris Chang will be retiring (again) shortly, I am hopeful that his successor will be able to continue the legacy of foundry industry leadership… Read More
The foundry executive shuffle continues at Samsung, GlobalFoundries, and TSMC. Some expected, some not, the needs of the many outweigh the needs of the few. As I have mentioned before I have no inside knowledge as to who will be named as Dr. Morris Chang’s successor but here is my candidate for the next TSMC CEO.
First, the executive… Read More
The 5[SUP]th[/SUP] annual TSMC OIP Forum was last week and thankfully there were no surprises with the exception of how many people asked me who I think will be the next TSMC CEO. Certainly I have no idea but I would be happy to use my incredible powers of deductive reasoning to determine who it will be.
The TSMC Open Innovation Platform®… Read More
One of TSMC’s two big Silicon Valley events each year is the Open Innovation Platform (OIP) Forum. This year it is on Tuesday October 1st. It is in the San Jose Convention Center and starts at 9am (registration opens at 8am). Pre-registration to attend is now open here or click on the image to the right.
From 9.10 to 9.40 is the … Read More
The existence of TSMC’s Open Innovation Platform (OIP) program further sped up disaggregation of the semiconductor supply chain. Partly, this was enabled by the existence of a healthy EDA industry and an increasingly healthy IP industry. As chip designs had grown more complex and entered the system-on-chip (SoC) era, the amount… Read More
Today TSMC announced three reference flows that they have been working on along with various EDA vendors (and ARM and perhaps other IP suppliers). The three new flows are:
Now that the IDF 2013 euphoria is fading I would like to play devil’s advocate and make a case for why Intel is still not ready to compete in the mobile market. It was very clear from the keynotes that Intel is a chip company, always has been, always will be, and that will not get them the market share they need to be relevant in mobile electronics,… Read More
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[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)