Embedded non-volatile memory (eNVM) plays an essential role in most systems and SoCs. eFLASH has found its way into a wide range of devices, including automotive, industrial, IoT and those in a mixture of other markets. NAND Flash has proven to be a workhorse in all of these areas. For instance, MCUs use them for code and data storage… Read More
TSMC 32Mb Embedded STT-MRAM at ISSCC2020
32Mb Embedded STT-MRAM in ULL 22nm CMOS Achieves 10ns Read Speed, 1M Cycle Write Endurance, 10 Years Retention at 150C and High Immunity to Magnetic Field Interference presented at ISSCC2020
1. Motivation for STT-MRAM in Ultra-Low-Leakage 22nm Process
TSMC’s embedded Spin-Torque Transfer Magnetic Random Access Memory (STT-MRAM)… Read More
TSMC’s 5nm 0.021um2 SRAM Cell Using EUV and High Mobility Channel with Write Assist at ISSCC2020
Technological leadership has long been key to TSMC’s success and they are following up their leadership development of 5nm with the world’s smallest SRAM cell at 0.021um 2 with circuit design details of their write assist techniques necessary to achieve the full potential of this revolutionary technology. In addition to their… Read More
GLOBALFOUNDRIES Sets a New Bar for Advanced Non-Volatile Memory Technology
Whether it’s the solid-state disk in your laptop, IoT/automotive hardware or edge-based AI, embedded non-volatile memory (eNVM) is a critical building block for these and many other applications. The workhorse technology for this capability has typically been NOR flash (eFlash), but a problem looms as eFlash presents challenges… Read More
System Level Flows for SoC Architecture Analysis and Design – DVCON 2020
As a professional conference attendee I look for the most meaningful way to spend my time and workshops is one of the best. Especially when a customer is involved and there is no bigger EDA customer than Intel, absolutely.
System Level Flows for SoC Architecture Analysis and Design
Speakers:
Swaminathan Ramachandran – … Read More
TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019
Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020. This 5nm technology is a full node scaling from 7nm using smart scaling… Read More
Intel vs AMD Q4 2019 Conference Calls
Now that the dust has settled and I’m out of cronovirus quarantine let’s talk about the Intel and AMD conference calls. Unfortunately, the Intel and AMD marketing teams are still outpacing engineering so it is difficult to write something serious but I will do my best.
Spoiler Alert: Both CEOs disappoint.
First an Intel 10nm update:… Read More
WEBINAR: Prototyping With Intel’s New 80M Gate FPGA
The next generation FPGAs have been announced, and they are BIG! Intel is shipping its Stratix 10 GX 10M FPGA, and Xilinx has announced its VU19P FPGA for general availability in the Fall of next year. The former is expected to support about 80M ASIC gates, and the latter about 50M ASIC gates. And, to bring this mind-boggling gate… Read More
Specialized Accelerators Needed for Cloud Based ML Training
The use of machine learning (ML) to solve complex problems that could not previously be addressed by traditional computing is expanding at an accelerating rate. Even with advances in neural network design, ML’s efficiency and accuracy are highly dependent on the training process. The methods used for training evolved from CPU… Read More
ASML “A Swing to Memory Looms” Nice performance while awaiting Memory bounce
- Good Q4 & 2019 despite weak memory
- 2020 will be up year but memory an unknown
- EUV ramp is on track – no China or memory impact
ASML reported sales of 4B Euros and a nice gross margin of 48% resulting in 2.70 Euros per share in earnings. Orders came in at 2.4B
Bluetooth 6.0 Channel Sounding is Here