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What Does Intel Look Like 10 Years From Now?

What Does Intel Look Like 10 Years From Now?
by Daniel Nenni on 09-08-2014 at 7:00 am

Intel (INTC) CEO Brian Krzanich keynoted the Citi Global Technology Conference last week. This was a precursor to the Intel Developer Forum in San Francisco this week. Normally these types of events are scripted dog and pony shows but sometimes interesting information comes out. The first question for example:

What does IntelRead More


Design & EDA Collaboration Advances Mixed-Signal Verification through VCS AMS

Design & EDA Collaboration Advances Mixed-Signal Verification through VCS AMS
by Pawan Fangaria on 09-07-2014 at 8:00 pm

Last week it was a rare opportunity for me to attend a webinar where an SoC design house, a leading IP provider and a leading EDA tool provider joined together to present on how the tool capabilities are being used for advanced mixed-signal simulation of large designs, faster with accuracy. It’s always been a struggle to combine design… Read More


TSMC OIP: Registration Open

TSMC OIP: Registration Open
by Paul McLellan on 09-06-2014 at 9:00 am

It’s that time of year again! The 4th TSMC Open Innovation Platform Ecosystem Forum is coming up on September 30th. As usual it is in the San Jose conference center. The TSMC OIP Ecosystem Forum brings together TSMC’s design ecosystem companies and their customers to share real case solutions to today’s design challenges.… Read More


A couple of misconceptions about FD-SOI

A couple of misconceptions about FD-SOI
by Eric Esteve on 09-03-2014 at 9:59 am

We have extensively discussed in Semiwiki about FD-SOI technology, explaining the main advantages (Faster, Cooler, Simpler), sometimes leading to very deep technical discussions, thanks to Semiwiki readers and their posts. I have recently found an article “Samsung & ST Team Up on 28nm FD-SOI. This article includes many… Read More


Granite River Labs and TSMC Expand Agreement

Granite River Labs and TSMC Expand Agreement
by Paul McLellan on 08-28-2014 at 7:01 am

For several years now, TSMC has run increasingly sophisticated IP validation. Ramping a new process as a foundry requires a number of things to all come together almost simultaneously: the process, of course, and some designs to run and start to recover the huge capital investment a modern fab entails. With many SoCs having over… Read More


Secure at any IoT deed

Secure at any IoT deed
by Don Dingee on 08-25-2014 at 3:00 pm

In his classic book “Unsafe at Any Speed”, Ralph Nader assailed the auto industry and their approach to styling and cost efficiency at the expense of safety during the 1960s. He squared up on perceived defects in the Chevrolet Corvair, but extended his view to wider issues such as tire inflation ratings favoring passenger comfort… Read More


SEMulator3D: GlobalFoundries Process Variation Reduction

SEMulator3D: GlobalFoundries Process Variation Reduction
by Paul McLellan on 08-19-2014 at 7:01 am

At SEMICON last month, Rohit Pal of GlobalFoundries gave a presentation on their methodology for reducing process variation. It was titled Cpk Based Variation Reduction: 14nm FinFET Technology.

Capability indices such as Cpk is a commonly used technique to assess the variation maturity of a technology. It looks at a given parameter’s… Read More


Intel 14nm is NOT in Production Yet!

Intel 14nm is NOT in Production Yet!
by Daniel Nenni on 08-18-2014 at 2:01 pm

Okay, maybe I’m the only one questioning Intel 14nm yield but I think it will be an interesting discussion in the comments section. Here are the questions I would have asked Intel during their recent 14nm PR tour: Has the P1272 process been rolled out to the production fabs in OR, AZ, and Ireland? Is the process officially in production… Read More


FD-SOI at 14nm

FD-SOI at 14nm
by Paul McLellan on 08-17-2014 at 7:01 am

At the recent Semicon West, Michel Haond of ST Microelectronics had a presentation on 14nm FD-SOI, or what they more lengthily call UTBB FD-SOI (which when you expand it all out comes to Ultra Thin Body and Buried-Oxide Fully Depleted Silicon on Insulator). When Chenming Hu (or whoever in his group) came up with the term FinFET it … Read More


When TSMC advocates FD-SOI…

When TSMC advocates FD-SOI…
by Eric Esteve on 08-14-2014 at 1:00 pm

I found a patent recently (May,14 2013) granted to TSMC “Planar Compatible FDSOI Design Architecture”, the following sentences, directly extracted from this patent, advertise FDSOI design better than a commercial promotion! “Devices formed on SOI substrates offer many advantages over their bulk counterparts, includingRead More