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Edge Devices Rely on Intelligent MEMS Based Sensors

Edge Devices Rely on Intelligent MEMS Based Sensors
by Tom Simon on 03-29-2018 at 12:00 pm

MEMS sensors play a huge role in intelligent systems these days. Mobile and IoT devices would essentially be blind if not for the rich variety of MEMS sensors integrated into them. The MEMS sensor market is growing rapidly, topping $10B in 2016 and slated to exceed $20B by 2020. MEMS is also growing in the RF market, where they are providing… Read More


Machine Learning Neural Nets and the On-Chip Network

Machine Learning Neural Nets and the On-Chip Network
by Bernard Murphy on 03-15-2018 at 7:00 am

Machine learning (ML), and neural nets (NNs) as a subset of ML, are blossoming in all sorts of applications, not just in the cloud but now even more at the edge. We can now find them in our phones, in our cars, even in IoT applications. We have all seen applications for intelligent vision (e.g. pedestrian detection) and voice recognition… Read More


ARM and embedded SIM

ARM and embedded SIM
by Bernard Murphy on 03-06-2018 at 7:00 am

It seems that a hot ticket at Mobile World Congress this year was embedded SIM announcements. As a reminder of why this space is hot, cellular communication for provisioning and data uploads is a very real option for many IoT devices. In agricultural, smart energy and asset tracking applications for example, near-range options… Read More


An AI assist for 5G enhanced Mobile Broadband for mobile platforms

An AI assist for 5G enhanced Mobile Broadband for mobile platforms
by Bernard Murphy on 02-23-2018 at 7:00 am

If you’re not up-to-speed on 5G, there are three use-cases: eMBB(enhanced mobile broadband) for mobile platforms (Gbps rates, immersive gaming, VR, AR – spectrum usage also extends up to mmWave, but that’s a different topic), mMTCfor massive machine type communication (ultra-low cost, ultra-low power, very dense networks)… Read More


A Development Lifecycle Approach to Security Verification

A Development Lifecycle Approach to Security Verification
by Bernard Murphy on 02-22-2018 at 7:00 am

We have become accustomed to the idea that safety expectations can’t be narrowed down to one thing you do in design. They pervade all aspects of design from overall process through analysis, redundancies in design, fault analytics and mitigation for faults and on-board monitors for reliability among other requirements and techniques.… Read More


CEVA ClearVox Simplifies Voice Pickup

CEVA ClearVox Simplifies Voice Pickup
by Bernard Murphy on 01-08-2018 at 7:00 am

Voice-based control is arguably becoming another killer app, or killer app-enabler in the very significant shifts we are seeing in automation. After a bumpy start in car feature control (for navigation, phone calls, etc) and early smartphone “intelligent” assistants, voice-based interfaces now seem to be maturing into a genuinely… Read More


CEVA Ups the Ante for Edge-Based AI

CEVA Ups the Ante for Edge-Based AI
by Bernard Murphy on 01-05-2018 at 6:00 am

AI is quickly becoming the new killer app and everyone is piling on board as fast as they can. But there are multiple challenges for any would-be AI entrepreneur:

  • Forget about conventional software development; neural nets require a completely different infrastructure and skill-sets
  • More and more of the interesting opportunity
Read More

CEVA and Local AI Smarts

CEVA and Local AI Smarts
by Bernard Murphy on 11-28-2017 at 7:00 am

When we first started talking about “smart”, as in smart cars, smart homes, smart cities and the like, our usage of “smart” was arguably over-generous. What we really meant was that these aspects of our daily lives were becoming more computerized and connected. Not to say those directions weren’t useful and exciting, but we weren’t… Read More


Tensilica Vision P6 DSP is Powering Huawei Kirin 970 Image

Tensilica Vision P6 DSP is Powering Huawei Kirin 970 Image
by Eric Esteve on 11-17-2017 at 7:00 am

Cadence has recently announced two key design-in for their Vision DSP IP family: MediaTek’s Helio P30 integrates the Tensilica Vision P5 DSP and HiSilicon has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor. The Kirin 970 being integrated into Huawei’s new Mate 10 Series mobile… Read More


Webinar: High-Capacity Power Signoff Using Big Data

Webinar: High-Capacity Power Signoff Using Big Data
by Bernard Murphy on 11-07-2017 at 7:00 am

Want to know how NVIDIA signs off on power integrity and reliability on mega-chips? Read on.

PPA over-design has repercussions in increased product cost and potential missed schedules with no guarantee of product success. Advanced SoCs pack more functionality and performance resulting in higher power density, but traditional… Read More