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WP_Term Object
(
    [term_id] => 16126
    [name] => Lithography
    [slug] => lithography
    [term_group] => 0
    [term_taxonomy_id] => 16126
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 161
    [filter] => raw
    [cat_ID] => 16126
    [category_count] => 161
    [category_description] => 
    [cat_name] => Lithography
    [category_nicename] => lithography
    [category_parent] => 0
    [is_post] => 
)

TSMC 5nm and EUV Update 2018

TSMC 5nm and EUV Update 2018
by Daniel Nenni on 01-23-2018 at 12:00 pm

The TSMC Q4 2017 earnings call transcript is up and I found it to be quite interesting for several reasons. First and foremost, this is the last call Chairman Dr. Morris Chang will participate in which signifies the end of a world changing era for me and the fabless semiconductor ecosystem, absolutely. TSMC announced his retirement… Read More


ISS 2018 – The Impact of EUV on the Semiconductor Supply Chain

ISS 2018 – The Impact of EUV on the Semiconductor Supply Chain
by Scotten Jones on 01-18-2018 at 8:00 am

I was invited to give a talk at the ISS conference on the Impact of EUV on the Semiconductor Supply Chain. The ISS conference is an annual gathering of semiconductor executives to review technology and global trends. In this article I will walk through my presentation and conclusions.… Read More


SEMICON West – EUV Readiness Update

SEMICON West – EUV Readiness Update
by Scotten Jones on 08-11-2017 at 12:00 pm

At the imec technology forum held at SEMICON West, Martin Van Den Brink, President and CTO of ASML presented on the latest developments on EUV. I also had an opportunity to sit down with Mike Lercel, ASML Director of Strategic Marketing for an interview.… Read More


SPIE 2017 – imec papers and interview

SPIE 2017 – imec papers and interview
by Scotten Jones on 04-28-2017 at 12:00 pm

At the SPIE Advanced Lithography Conference imec published a number of papers on EUV, multi-patterning and other lithography issues. In addition to seeing several of the papers presented I had a chance to sit down with imec’s director of advanced patterning, Greg McIntyre. In this article I will summarize my discussions… Read More


SPIE 2017 – ASML Interview and Presentations

SPIE 2017 – ASML Interview and Presentations
by Scotten Jones on 04-19-2017 at 7:00 am

At the SPIE Advanced Lithography conference I sat down with Mike Lercel, Director of Strategic Marketing for ASML for an update. ASML also presented several papers at the conference and I attended many of these. In this article, I will discuss my interview with Mike and summarize the ASML presentations.… Read More


SPIE 2017 ASML and Cadence EUV impact on place and route

SPIE 2017 ASML and Cadence EUV impact on place and route
by Scotten Jones on 04-13-2017 at 7:00 am

As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More


SPIE 2017: Irresistible Materials EUV Photoresist

SPIE 2017: Irresistible Materials EUV Photoresist
by Scotten Jones on 04-11-2017 at 7:00 am

Irresistible Materials (IM) is a spin-out of the University of Birmingham in the United Kingdom that has been doing research on Photoresist and Spin-On Carbon hard masks for 10 years, most recently with Nano-C on chemistry development. IM has developed a unique EUV photoresist and they are now looking for partners to help bring… Read More


SPIE 2017: EUV Readiness for High Volume Manufacturing

SPIE 2017: EUV Readiness for High Volume Manufacturing
by Scotten Jones on 03-03-2017 at 12:00 pm

The SPIE Advanced Lithography Conference is the world’s leading conference addressing photolithography. This year on the opening day of the conference, Samsung and Intel presented papers summarizing the readiness of EUV for high volume manufacturing (HVM). In this article, I will begin by summarizing the EUV plans … Read More


AMAT LRCX and EUV Economics

AMAT LRCX and EUV Economics
by Robert Maire on 11-23-2016 at 7:00 am

Lam & Applied talked about “sustainable” growth Both expect share gains & growth in a flattish market. We examine the “new, lower, cyclicality”. Although Applied and Lam are fierce competitors , coming at things from different directions, they sounded awfully similar last week.
Read More


EUV transition comes into focus

EUV transition comes into focus
by Robert Maire on 11-04-2016 at 12:00 pm

We attended ASML’s analyst day in New York on Halloween. We were very impressed with the quality, content and clarity of the presentations and thought it was one of the best strategic positioning presentations we have seen in the semi industry. We also had an opportunity to meet with several members of senior management afterRead More