Based on press coverage and technical paper volume, you could be forgiven for thinking that Korea had decided to take a pass on AI mania, or maybe just to dabble a little here and there to stay abreast of trends. But you’d be wrong. Korea is very active in AI; they don’t feel a need to trumpet what they’re doing from the rooftops. If you … Read More
Semiconductor Intellectual Property
Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The talk covered here focuses on a complete on-die clock … Read More
Blue Cheetah Technology Catalyzes Chiplet Ecosystem
There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More
Combo Wireless. I Want it All, I Want it Now
When we think of wireless it is natural to wonder “which one – cellular, Wi-Fi, BLE?” Our phones support everything but those are pricey devices. What if we wanted the same combo wireless option in a low-cost IoT device, maybe something that only need to send a small amount of data periodically? Logistics applications are a good example.… Read More
Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More
In-Chip Monitoring Helps Manage Data Center Power
Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More
PCI Express in Depth – Transaction Layer
In the last article i write about the Data Link Layer, in this article i’ll write about the Transaction Layer.
This layer’s primary responsibility is to create PCI Express request and completion transactions. It has both transmit functions for outgoing transactions, and receive functions for incoming transactions.… Read More
PCI Express in Depth – Data Link Layer
In the last article, i wrote about the physical layer, now let’s take a look in the next layer the data link layer.
The Data Link Layer serves as the “gatekeeper” for each individual link within a PCI Express system. It ensures that the data being sent back and forth across the link is correct and received in the same order it
How an Nvidia/ARM deal could create the dominant ecosystem for the next computer era
Over the past few weeks, there have been numerous reports about Nvidia’s overtures to acquire Arm. The news has mostly been obsessed about the $31 billion that Arm’s current owner, Softbank, paid for Arm and whether Nvidia could pay such an eye-watering price to buy this asset. There is also pushback from Herman Hauser who was one… Read More
Cerebras and Analog Bits at TSMC OIP – Collaboration on the Largest and Most Powerful AI Chip in the World
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The topic at hand was full of superlatives, which isn’t surprising… Read More
Should Intel be Split in Half?