Way back in the early 2000s when XAUI was falling short on link flexibility a search for an alternative chip-to-chip data transfer interface with SPI like features lead Cisco Systems and Cortina System to put forward the proposal for the Interlaken standard. The new standard married the best of XAUI’s serialized data and SPI’s … Read More
Semiconductor Intellectual Property
CEO Interview: Jan Peter Berns from Hyperstone
Since 2012, Dr. Jan Peter Berns is the CEO of Hyperstone, a producer of Flash Memory Controllers for Industrially Embedded Storage Solutions. Before that, he held a Senior Manager Position at Toshiba Electronics for several years. Jan Peter brings more than 20 years of management and executive experience in the semiconductor… Read More
Coherency in Heterogeneous Designs
Ever wonder why coherent networks are needed beyond server design? The value of cache coherence in a multi-core or many-core server is now well understood. Software developers want to write multi-threaded programs for such systems and expect well-defined behavior when accessing common memory locations. They reasonably expect… Read More
Delivering 3D IC Innovations Faster
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other IDMs were the ones to typically leverage this … Read More
ARC Processor Summit 2022 Your embedded edge starts here!
As embedded systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these embedded applications must be efficient to deliver high levels of performance within limited power… Read More
Flex Logix Partners With Intrinsic ID To Secure eFPGA Platform
While the ASIC market has always had its advantages over alternate solutions, it has faced boom and bust cycles typically driven by high NRE development costs and time to market lead times. During the same time, the FPGA market has been consistently bringing out more and more advanced products with each new generation. With very… Read More
DSP IP for High Performance Sensor Fusion on an Embedded Budget
Whether we realize it or not, everyday applications we use depend on data gathered by sensors. We can bet that pretty much every application uses at least a couple of different types of sensors, if not more. That is because different types of sensors are better suited to collect data depending on the application, the environment … Read More
Chiplets at the Design Automation Conference with OpenFive
SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets at DAC#59 was OpenFive, a 17+ year spec-to-silicon… Read More
Scalability – A Looming Problem in Safety Analysis
Scalability – A Looming Problem in Safety Analysis
The boundless possibilities of automation in cars and other vehicles have captivated designers to the point that electronic content is now a stronger driver of differentiation than any other factor. It accounts for a substantial fraction of material cost in any of these vehicles.… Read More
Arm Aims at Mobile Gaming
Clearly unfazed by the collapse of the proposed merger with Nvidia, Arm just announced products in support of, what else, mobile gaming. Nvidia turf. Of course Nvidia’s gaming strength is in tethered platforms or laptops. However, understand that 50% of video gaming revenue in 2020 came from smartphone games and that growth is… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities