Apple’s stock is down 10% after they announced “disappointing” results. They are only disappointing in the sense that some analysts expected even bigger profits. At $13.08 billion it is the largest quarterly profit for any corporation that is not in the oil business ever. According to wikipedia, even the … Read More
Semiconductor Intellectual Property
A Brief History of Sidense
Sidense Corp. is a leading developer of embedded non-volatile memory (NVM) intellectual property (IP) for the semiconductor IC market. The company is headquartered in Ottawa, Canada, and has a global presence with sales offices worldwide.
The company was founded in 2004 by CTO Wlodek Kurjanowicz, a MoSys fellow and co-founder… Read More
How to manage decreasing by 70% a $5B IC business in less than 6 years? TI knows the answer…
The Wireless Business Unit (WBU) from TI was created in the mid 90’s to structure the chip business in wireless handset made with customers like Nokia, Ericsson or Alcatel. I had a deep look at the WBU results: quickly growing from $1B in 2000 to reach about $5B in 2005… to finally decrease by 70%, down to $1.3B in 2012.
Let’s make it clear:… Read More
The Linley Microprocessor Conference: Weather Cloudy
The Linley Group’s Microprocessor conference in Spring is focused on Datacenters now that cloud computing and massive internal datacenters has made them so important. The conference is on February 5th and 6th. It is free to qualified people such as network equipment vendors, network service providers and so on (which … Read More
New PCI Express 3.0 Equalization Requirements
PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for… Read More
Buying DDRn Controller IP AND Memory Model to the same IP vendor gives real TTM advantage
We all know the concept of “one stop shop”, becoming popular in the Design IP market. The topic we will address today is NOT the “one stop shop”, even if it looks similar, but rather that we could call “consistent design flow”.
What does that means? Simply that, if your SoC design is integrating a DDRn (LPDDR2, DDR3 or even DDR4, let’s… Read More
All Things Resistive
A quick re-introduction of ReRAM-Forum.com which is dedicated to all things related to resistive RAM, broadly characterized as ReRAM (or RRAM) and CBRAM. The technology is seen as the ‘next generation’ non-volatile memory solution and is being developed by companies large and small for a variety of applications in storage, … Read More
Scandals Rock and Shock CES 2013!
Like any other event, the Consumer Electronics Show in Las Vegas is not immune to unethical and inappropriate behavior. Unfortunately one of digital media’s finest got caught this year doing what most publications have done since the beginning of time. CNET bowed to pressure from above and changed the outcome of the annual… Read More
IP vendors enable SuperSpeed USB IP take off in 2012
SuperSpeed USB has been clearly ranked in the Interface protocols winner list, see this previous post. It could be interesting to dig into this IP market segment, determine in which applications USB 3.0 has been successfully deployed and who are the IP vendors serving this market, enabling SuperSpeed USB to take off.
SuperSpeed… Read More
Battling SoCs: QCOM vs NVDA vs Samsung
If I had to describe CES in one word it would be exhausting. There were 3,000+ vendors, 150,000+ people, lines for everything, but 100% pure excitement. Even my beautiful wife was intrigued by the technology that shapes our lives. The smart toaster was of great interest to her since she says I time my toast with the smoke alarm. The … Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?