hip webinar automating integration workflow 800x100 (1)
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Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes

Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes
by Daniel Nenni on 01-04-2013 at 7:00 pm

The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcaseRead More


Audio/Voice DSP IP core: the next road to billion unit shipment

Audio/Voice DSP IP core: the next road to billion unit shipment
by Eric Esteve on 01-04-2013 at 6:09 am

When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering… Read More


Formal Verification at ARM

Formal Verification at ARM
by Paul McLellan on 12-20-2012 at 4:34 pm

There are two primary microprocessor companies in the world these days: Intel and ARM. Of course there are many others but Intel is dominant on the PC desktop (including Macs) and ARM is dominant in mobile (including tablets).

One of the keynotes at last month’s Jasper User Group (JUG, not the greatest of acronyms) was by Bob… Read More


Cortex-A9 speed limits and PPA optimization

Cortex-A9 speed limits and PPA optimization
by Don Dingee on 12-19-2012 at 3:01 pm

We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.

My curiosity kicked in when I looked at the recent press release… Read More


New HP Memristor Material Developments

New HP Memristor Material Developments
by Ed McKernan on 12-12-2012 at 10:00 pm

At the recent NCCAVS Thin Film Users Group meeting in November, HP was on the program in the person of Joshua Yang who gave a materials centric look at the status of the HP ReRAM (Memristor) program. A colleague passed on the informative set of slides presented at the meeting. Being a former process integration team leader, I was immediately… Read More


When ARM and CEVA team-up for “Designing a Multi-core LTE-A Modem”

When ARM and CEVA team-up for “Designing a Multi-core LTE-A Modem”
by Eric Esteve on 12-11-2012 at 4:25 am

ARM and CEVA have launched a white paper, addressing one of the hottest topics of the day: LTE-Advanced modem architecture. This very exhaustive paper, written by David Maidment (Mobile Segment Manager, ARM), Chris Turner (Senior Product Manager, ARM) and Eyal Bergman (VP Product Marketing, Baseband & Connectivity, CEVA… Read More


How Apple Plans to Leverage Intel’s Foundry

How Apple Plans to Leverage Intel’s Foundry
by Ed McKernan on 12-09-2012 at 4:00 pm

Tim Cook’s strategy to disengage from Samsung as a supplier of LCDs, memory and processors while simultaneously creating a worldwide supply chain from the remnants of former leaders like Sharp, Elpida, Toshiba and soon Intel is remarkable in its scope and breadth. By 2014, Apple should have in place a supply chain for 500M iOS devices… Read More


A Brief History of the MIPS Architecture

A Brief History of the MIPS Architecture
by IMGJen on 12-07-2012 at 1:00 pm

MIPS is one of the most prolific, longest-living industry-standard processor architectures, existing in numerous incarnations over nearly three decades.

MIPS has powered products including game systems from Nintendo and Sony; DVRs from Dish Network, EchoStar and TiVo; set-top boxes from Cisco and Motorola; DTVs from Samsung… Read More


Subsystem IP, myth or reality?

Subsystem IP, myth or reality?
by Eric Esteve on 12-07-2012 at 5:00 am

I have participated to a panel during IP-SoC, I must say that “Subsystem IP, myth or Reality” was a great moment. The panel was a mix of mid-size IP vendor (CAST, Sonics), one large EDA (Martin Lund from Cadence), Semiwiki blogger and one large IDM (Peter Hirt from STM) who has very well represented the customer side. And, to make the… Read More


A Brief History of the Fabless Semiconductor Ecosystem

A Brief History of the Fabless Semiconductor Ecosystem
by Daniel Nenni on 12-05-2012 at 7:00 pm

Clearly the fabless semiconductor ecosystem is driving the semiconductor industry and is responsible for both the majority of the innovation and the sharp decline in consumer electronics costs we have experienced. By definition, a fabless semiconductor company does not have to spend the time and money on manufacturing related… Read More