SILVACO 073125 Webinar 800x100
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Analog Bits Builds a Road to the Future at TSMC OIP

Analog Bits Builds a Road to the Future at TSMC OIP
by Mike Gianfagna on 10-21-2024 at 6:00 am

Analog Bits Builds a Road to the Future at TSMC OIP

The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More


Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter

Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter
by Bernard Murphy on 10-16-2024 at 6:00 am

chatbot list of suggestions min

Arm has been making noise about running large language models (LLMs) on mobile platforms. At first glance that sounds wildly impractical, other than Arm acting as an intermediary between a phone and a cloud-based LLM. However Arm are partnered with Meta to run Llama 3.2 on-device or in the cloud, apparently seamlessly. Running… Read More


How AI is Redefining Data Center Infrastructure: Key Innovations for the Future

How AI is Redefining Data Center Infrastructure: Key Innovations for the Future
by Kalar Rajendiran on 10-10-2024 at 10:00 am

Connectivity Demands for AI Alphawave Semi

Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More


Navigating Frontier Technology Trends in 2024

Navigating Frontier Technology Trends in 2024
by Kalar Rajendiran on 10-09-2024 at 10:00 am

Mena Issler on Stage Silicon Catalyst Sep 19, 2024

Many of you are already familiar with Silicon Catalyst and the value it brings to semiconductor startups, the industry and the electronics industry at large. Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and… Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Podcast EP250: The Inner Workings of RISC-V International and Details About the RISC-V Summit with Andrea Gallo

Podcast EP250: The Inner Workings of RISC-V International and Details About the RISC-V Summit with Andrea Gallo
by Daniel Nenni on 10-04-2024 at 10:00 am

Dan is joined by Andrea Gallo, Vice President of Technology at RISC-V International. Andrea heads up the Technical Activities in collaboration with RISC-V members across workgroups and committees in growing the adoption of the RISC-V Instruction Set Architecture. Prior to RISC-V International, Andrea held multiple roles… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Andes Technology is Expanding RISC-V’s Horizons in High-Performance Computing Applications

Andes Technology is Expanding RISC-V’s Horizons in High-Performance Computing Applications
by Charlie Su on 09-24-2024 at 6:00 am

Andes Chip

By: Dr. Charlie Su, President and CTO, Andes Technology Corp.

At Andes Technology, we are excited to share some of our latest advancements and insights into the growing role of RISC-V in several high-performance applications. According to the SHD Group report, “IP Market RISC-V Market Report: Application Forecasts in… Read More


Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More