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Cadence DSPs float for efficiency in complex apps

Cadence DSPs float for efficiency in complex apps
by Don Dingee on 09-29-2016 at 4:00 pm

Floating-point computation has been a staple of mainframe, minicomputer, supercomputer, workstation, and PC platforms for decades. Almost all modern microprocessor IP supports the IEEE 754 floating-point standard. Embedded design, for reasons of power and area and thereby cost, often eschews floating-point hardware… Read More


16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP

16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
by Tom Simon on 09-29-2016 at 12:00 pm

Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More


It’s a heterogeneous world and cache rules it now

It’s a heterogeneous world and cache rules it now
by Don Dingee on 09-28-2016 at 4:00 pm

Cache evolved when the world was all about homogeneous processing and slow and expensive shared memory. Now, compute is just part of the problem – devices need to handle display, connectivity, storage, and other tasks, all at the same time. Different, heterogeneous cores handle different workflows in the modern SoC, and the burden… Read More


eSilicon Revolutionizes Semiconductor IP Selection and Purchasing!

eSilicon Revolutionizes Semiconductor IP Selection and Purchasing!
by Daniel Nenni on 09-21-2016 at 10:00 am

Design starts are the lifeblood of the semiconductor industry which is why we have been following the eSilicon STAR Platform since its introduction with great anticipation. The STAR platform was first launched about three years ago. Today, there are over 1,300 registered STAR users in 52 countries around the world.

The ASIC business… Read More


Next Book Signing: Linley Processor Conference 2016!

Next Book Signing: Linley Processor Conference 2016!
by Daniel Nenni on 09-20-2016 at 12:00 pm

It is a busy month for book signings but it is a pleasure to do it for the greater good of the semiconductor industry. It really is an honor to meet the people who keep our electronic devices on the leading edge of technology, absolutely.

The Linley Processor Conference is on September 27[SUP]th[/SUP]and 28[SUP]th[/SUP] at the Hyatt… Read More


FREE Fabless: The Transformation of the Semiconductor Industry!

FREE Fabless: The Transformation of the Semiconductor Industry!
by Daniel Nenni on 09-19-2016 at 12:00 pm

As most of you know SemiWiki published a book which is a really nice history of the fabless semiconductor ecosystem. Thousands of people have copies, we have received many compliments on it, and we are very proud. As a thank you to all SemiWiki members I would like to offer a free electronic version of the book (PDF). You can access it… Read More


CEO Interview: Xerxes Wania of Sidense

CEO Interview: Xerxes Wania of Sidense
by Daniel Nenni on 09-19-2016 at 7:00 am

This is the first in a series of CEO interviews and I thought semiconductor IP would be a great place to start. Xerxes Wania is the President and CEO of Sidense, a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores. Sidense has been a part of SemiWiki since 2013 so we know them quite well. I hope the rest… Read More


Is Your Next Reality Going to be Augmented?

Is Your Next Reality Going to be Augmented?
by Rick Tewell on 09-01-2016 at 7:00 am

John Lennon reportedly once said “Reality leaves a lot to the imagination…” and now we have the technology to do something about making our reality a lot more imaginative. Unless you have been living under a rock (and there is nothing wrong with that – I just haven’t found the right rock myself) there is a LOT going on these days in the… Read More


The Role of IP Selection and Integration in First-Time Silicon Success

The Role of IP Selection and Integration in First-Time Silicon Success
by Daniel Nenni on 08-31-2016 at 12:00 pm

As IP expert Eric Esteve has written, Semiconductor IP has consistently outgrown the other design enablement segments and will continue to do so. This has been my personal experience as well during my EDA and IP career so we should all know how important Semiconductor IP is. We certainly know how valuable it is with ARM valued at $32B!… Read More


I3C Will Support MIPI Pervasion Beyond Mobile: IoT, Wearable, Automotive

I3C Will Support MIPI Pervasion Beyond Mobile: IoT, Wearable, Automotive
by Eric Esteve on 08-30-2016 at 7:00 am

MIPI I3C specification Draft Specification is now available to all MIPI Alliance members in First Draft Review, but we can be confident that I3C has been already implemented by some of the members. Before I3C specification, the de facto communication standard for sensors in mobile and consumer applications was I²C, requiring… Read More