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The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More
From initial process technology development (TD) to high volume manufacturing (HVM) status for a new node, one of the key support functions to improve and maintain yield is the in-line wafer inspection technology. Actually, there are multiple inspection technologies commonly employed, with tradeoffs in pixel resolution,… Read More
There is no shortage of reporting on the many technological advances happening within the semiconductor industry. But sometimes it feels like we hear less in the area of semiconductor manufacturing equipment than in the design and product arenas. That doesn’t mean that there is less happening there or what is happening there … Read More
“Inverse lithography technology (ILT) represents the most significant EDA advance in the last two decades.” Danping Peng from TSMC made that assertion at the recent SPIE Advanced Lithography + Patterning Conference, in his talk entitled: ILT for HVM: History, Present, and Future. This article summarizes the highlights… Read More
The capacity and energy efficiency challenges from the growing appetite for high-speed data along with advanced applications such as LIDAR and quantum computing are driving demand for increasingly large-scale photonic integrated circuits (PIC). With an ever-increasing number of components on a single photonic chip, manual… Read More
At the recent SPIE Advanced Lithography + Patterning Conference, Mark Phillips from Intel gave an insightful update on the status of the introduction of the 0.55 high numerical aperture extreme ultraviolet lithography technology. Mark went so far as to assert that the development progress toward high-NA EUV would support … Read More
I’ve been following the EM/IR (Electro-Migration, IR is current and resistance) analysis market for many years now, and recently attended a presentation from Steven Chin, Sr. Director IC Engineering of Efinix, at the User2User event organized by Siemens EDA. The Tuesday presentation was in the morning at the Marriott… Read More
The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More
One of the recent live events I attended was the 2022 GSA Silicon Leadership Summit on May 12th at the Santa Clara Convention Center (my favorite location). This was the first GSA live event in two years so it was a must attend gathering. This event targets semiconductor ecosystem executives (200+ people attended) so there were many… Read More
It’s a hostile world we live in, and cybersecurity of connected devices is a big concern. Attacks are rising rapidly, and vulnerabilities get exploited immediately. Supply chains are complex. Regulations are proliferating. Secrets don’t stay secrets for long – in fact, the only secret in a system with open-source algorithms… Read More
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Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems