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Events
Posted on

3D Thermal and Mechanical Stress for IC Packaging

3D Thermal and Mechanical Stress for IC Packaging
by Daniel Payne on 06-19-2012 at 8:02 pm
Categories: EDA, Events

3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More

Posted on

From SPICE Netlist back to Schematics at DAC

From SPICE Netlist back to Schematics at DAC
by Daniel Payne on 06-11-2012 at 5:22 pm
Categories: EDA, Events
4 Comments

I first heard about SPICE Vision Pro when working at Mentor Graphics where we needed a way to visualize SPICE netlists and debug SPICE simulation results node by node on a design where we didn’t have the original schematics. Last Monday I met the engineers from Concept Engineering in their booth at DAC to get an update, Gerhard… Read More

Posted on

Fast Monte Carlo and Analog Fast SPICE

Fast Monte Carlo and Analog Fast SPICE
by Daniel Payne on 06-08-2012 at 10:25 am
Categories: EDA, Events

Britto Vincent of ProPlus Design Solutions met with me at DAC on Monday morning to talk about Design For Yield (DFY) and Analog Fast SPICE.

In 2011 ProPlus announced DFY tools where the technology came from IBM, it provides fast Monte Carlo results up to 3 sigma, then added NanoSpice for faster simulation results. Similar in approach… Read More

Posted on

President Obama at DAC 2012

President Obama at DAC 2012
by Daniel Nenni on 06-07-2012 at 7:45 pm
Categories: EDA, Events
2 Comments


Okay, President Obama didn’t actually stop at DAC but he did do a drive by. I happened to be stepping out for some much needed fresh air and there goes his speeding motorcade. It was quite a sight actually, with all of the motorcycles, SUVs, a SWAT vehicle and even a paramedic rig (my son the Fireman drives one of those). The president … Read More

Posted on

Partitioning Panel

Partitioning Panel
by Paul McLellan on 06-06-2012 at 4:53 pm
Categories: EDA, Events
1 Comment

I moderated a panel on partitioning today and I have to say that I learned some things. The panelists were Jonathan DeMent from IBM, Santosh Santosh from NVIDIA and Hao Nham of eSilicon. Considering the different types of designs being done their approach to partitioning and the reasons for doing so were very similar.

When you first… Read More