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DAC 2012 Cheerleader Controversy!

DAC 2012 Cheerleader Controversy!
by Daniel Nenni on 07-08-2012 at 9:00 pm

First, I must say that I’m biased. I like Cheerleaders, they are lots of fun, I even married one. Second, I’m not a fan of Peggy Aycinena. She has been on her EDA feminist rant for years now and I have been targeted multiple times. My solution has been to ignore her and any publication that supports her but this time she has gone too far.… Read More


Robustness, Reliability and Yield at DAC

Robustness, Reliability and Yield at DAC
by Daniel Payne on 06-26-2012 at 8:15 pm

On Wednesday at DAC I met with Bob Slee, distributor and Michael Siu, AE for MunEDA to get an update on what’s new. MunEDA has EDA software for:

  • Schematic porting
  • Nominal circuit analysis
  • Nominal circuit optimization
  • Statistical circuit analysis
  • Statistical circuit optimization
  • IP porting
  • Circuit model generation
Read More

FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More


Finding RTL Bugs Live Using Formal Techniques

Finding RTL Bugs Live Using Formal Techniques
by Daniel Payne on 06-24-2012 at 8:10 pm

Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days… Read More


3D Thermal and Mechanical Stress for IC Packaging

3D Thermal and Mechanical Stress for IC Packaging
by Daniel Payne on 06-19-2012 at 8:02 pm

3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More


From SPICE Netlist back to Schematics at DAC

From SPICE Netlist back to Schematics at DAC
by Daniel Payne on 06-11-2012 at 5:22 pm

I first heard about SPICE Vision Pro when working at Mentor Graphics where we needed a way to visualize SPICE netlists and debug SPICE simulation results node by node on a design where we didn’t have the original schematics. Last Monday I met the engineers from Concept Engineering in their booth at DAC to get an update, Gerhard… Read More