By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More
ARM gets wider and more flexible in vectors
ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More
Semi execs look at IoT tradeoffs a bit differently
What happens when you get a panel of four executives together with an industry-leading journalist to discuss tradeoffs in IoT designs? After the obligatory introductions, Ed Sperling took this group into questions on power, performance, and integration.… Read More
Memory War Z: Samsung spins antidote to 3D XPoint
The 2016 edition of the Flash Memory Summit produced more than the usual amount of excitement. Samsung’s response to the Intel/Micron 3D XPoint challenge arrived in new slideware, indicating the war for next-generation SSDs is just starting. Who has the advantage?
We’d all like to think this is about creating a breakthrough technology,… Read More
Keynote: Silicon is the New Steel: Building the World’s First Terascale Network
Prof. Thomas Lee from Stanford University is the keynote speaker at the upcoming 38th EOS/ESD Symposium (September 11-16, Anaheim). The EOS/ESD Symposium is focused on discussing the issues and providing the answers to electrostatic discharge in electronic production and assembly.
Abstract:
Steel transformed civilization… Read More
Webinar Alert – Helping Mixed Signal not be Mixed Up
Today’s profound statement: “don’t fall in love with your tools, figure out the biz process change first.” Mixed-signal SoC designers are having ample challenges with their design process and are in need of design management, but don’t want another tool to do it.… Read More
LTE Trajectory Places High Demands on Baseband Processing
LTE stands for Long Term Evolution, and that is exactly what is happening. At the Linley Mobile & Wearables Conference 2016 we received a preview of what is coming in the mobile and wearable markets. LTE is one of the biggest drivers in this entire domain. There was much discussion about the LTE Release 12 and how it increases bandwidth,… Read More
Radio Integration – the Benefits of Built-In
It’s always a pleasure when a vendor gives a really informative, vendor-independent presentation on what’s happening in some domain of the industry and wraps up with (by that point) a well-deserved summary of that vendor’ solutions in that space. Ron Lowman did just that at the Linley conference on Mobile and Wearables, where … Read More
Linley Mobile and Wearable Conference Drills into Rapidly Evolving Markets
Last week the Linley conference on mobile and wearables started with an overview and keynote address by the event’s namesake Linley Gwennap. His talk offered a few surprises and was informative all around. As you have seen recently reported here on SemiWiki, he sees smartphone shipments continuing to rise, but with a declining… Read More
One transistor for the future of mmWave?
We’ve heard recently from several sources that millimeter wave radios, once the exclusive realm of defense and satellite use, are now finding homes in applications such as automotive radar and 5G networks. Therein lies a significant opportunity for digital design: moving frequency conversion and filtering from the analog … Read More


The AI PC: A New Category Poised to Reignite the PC Market