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Q2FY24TessentAI 800X100
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Going up…3D IC design tools

Going up…3D IC design tools
by Paul McLellan on 01-23-2012 at 6:41 pm

3D and 2.5D (silicon interposer) designs create new challenges for EDA. Not all of them are in the most obvious areas. Mentor has an interesting presentation on what is required for verification and testing of these types of designs. Obviously it is somewhat Mentor-centric but in laying out the challenges it is pretty much agnostic.… Read More


What is a Hierarchical SPICE Circuit Simulator?

What is a Hierarchical SPICE Circuit Simulator?
by Daniel Payne on 01-19-2012 at 2:56 pm

Hierarchy is used in IC designs at many abstraction levels to help describe a design in a compact format:

  • Mask Data
  • IC Layout
  • Schematic Netlists
  • Gate level netlists
  • RTL netlists

But the question and focus for this blog is, “What is a hierarchical SPICE Circuit Simulator?”… Read More


Advanced Memory Cell Characterization with Calibre xACT 3D

Advanced Memory Cell Characterization with Calibre xACT 3D
by SStalnaker on 01-12-2012 at 7:18 pm

Advanced process technologies for manufacturing computer chips enable more functionality, higher performance, and low power through smaller sizes. Memory bits on a chip are predicted to double every two years to keep up with the demand for increased performance.

To meet these new requirements for performance and power, memory… Read More


EDA Vendors Providing Secure Remote Support for an IC Design Flow

EDA Vendors Providing Secure Remote Support for an IC Design Flow
by Daniel Payne on 01-05-2012 at 5:38 pm

In my last corporate EDA job I had customers in Korea that were evaluating a new circuit simulator and getting strange results. When I asked, “Could you send me your test case?” the reply was always, “No, we cannot let any of our IC design data leave the building because of security concerns.”… Read More


iLVS: Improving LVS Usability at Advanced Nodes

iLVS: Improving LVS Usability at Advanced Nodes
by glforte on 12-13-2011 at 4:54 pm

LVS Challenges at Advanced Nodes

Accurate, comprehensive device recognition, connectivity extraction, netlist generation and, ultimately, circuit comparison becomes more complex with each new process generation. As the number of layers and layer derivations increases the complexity of devices, especially Layout Dependent… Read More


Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes

Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes
by glforte on 12-07-2011 at 3:52 pm

Preventing electrical circuit failure is a growing concern for IC designers today. Certain types of failures such as electrostatic discharge (ESD) events, have well established best practices and design rules that circuit designers should be following. Other issues have emerged more recently, such as how to check circuits… Read More


December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)

December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)
by Daniel Payne on 11-24-2011 at 9:57 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is BetterRead More


Reducing the Need for Guardbanding Flash ADC Designs

Reducing the Need for Guardbanding Flash ADC Designs
by SStalnaker on 11-22-2011 at 7:59 pm

Flash analog-to-digital converters (ADCs) are commonly used in high-frequency applications such as satellite communications, sampling oscilloscopes, and radar detection. Flash ADC is preferred over other ADC architectures because it is extremely fast and quite simple. However, flash ADC typically requires twice as many… Read More


Physical Verification of 3D-IC Designs using TSVs

Physical Verification of 3D-IC Designs using TSVs
by Daniel Payne on 11-12-2011 at 10:36 am

3D-IC design has become a popular discussion topic in the past few years because of the integration benefits and potential cost savings, so I wanted to learn more about how the DRC and LVS flows were being adapted. My first stop was the Global Semiconductor Alliance web site where I found a presentation about how DRC and LVS flows were… Read More