OK, let’s face it, when you think of post-silicon debug then formal verification is not the first thing that springs to mind. But once a design has been manufactured, debugging can be very expensive. As then-CEO of MIPS John Bourgoin said at DesignCon 2006, “Finding bugs in model testing is the least expensive and most desired… Read More
Electronic Design Automation
Cadence Verification IP Technical Seminar!
According to trusted sources it costs upwards of $50M to design a 40nm SoC down to the GDS. Semiconductor IP is a fast growing part of that equation and functional verification of that IP is critical. Hardware complexity growth continues to follow Moore’s Law but verification complexity is even more challenging. In fact, IP verification… Read More
WikiLeaks: Methodics vs IC Manage
Human nature never ceases to amaze me. I understand the recent economic turmoil and looming National Debt has thrown us for a loop but please, let us all get some perspective here and in the words of Rodney King, “Can we all get along?”
A clever little scumbag recently registered the domain danielnenni.com and is now hawking event … Read More
Top 5 Reasons for Wasting Power
Traditionally, David Letterman style, we should really have the top 10 reasons for wasting power in semiconductor design, but here are the five big ones.
Starting with reason #5: Lack of a power gating strategy
Leakage power is a huge proportion of total power and the only way to save leakage power (apart from low leakage cells when… Read More
Aug 25th in Fremont, CA – Hands on Calibre workshop: DRC, LVS, xRC, ERC, DFM
I’ve blogged about the Calibre family of IC design tools before:
Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is Better… Read More
Fast Track your SoC Design
Atrenta has four seminars coming up on SoC realization. More and more design is actually about finding IP and integrating it together at the block level, and then handing it off to a standard RTL to GDSII flow. The three focus areas are:
- finding quality IP faster
- accelerating IP integration and SoC assembly
- handing off RTL successfully.
ANSYS Regional Conference
Next Tuesday, August 23rd, is the ANSYS Regional Conference for Silicon Valley. It takes place at the Techmart Network Meeting Center. Apache has three presentations during the day:
- 9.25-9.45 Andrew Yang Introducing Apache Design Solutions
- 11.00-11.30 Methodology for delivering power-efficient designs from concept to
Solido – Variation Analysis and Design Software for Custom ICs
Introduction
When I designed DRAM chips at Intel I wanted to simulate at the worst case process corners to help make my design as robust as possible in order to improve yields. My manager knew what the worst case corners were based on years of prior experience, so that’s what I used for my circuit simulations.… Read More
Cadence VIP Seminar: next stop after Denali party, August 25th in San Jose
If you did not have the chance to attend the famous Denali party at DAC 2011, you may want to go to Cadence VIP seminar to be held on Thursday, August 25, 2011, from 1:00 – 4:15pm at Cadence Headquarters: 2655 Seely Avenue, San Jose, Building 10. To register, click here. The atmosphere could be slightly different, as during Denali… Read More
OPC Model Accuracy and Predictability – Evolution of Lithography Process Models, Part III
Wyatt Earp probably wasn’t thinking of OPC when he said, “Fast is fine, but accuracy is everything,” but I’ll adopt that motto for this discussion of full-chip OPC and post-OPC verification models.
Accuracy is the difference between the calibrated model prediction and the calibration wafer result. Accuracy depends on several… Read More
CHIPS Act dies because employees are fired – NIST CHIPS people are probationary