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IC Layout Design at Qualcomm

IC Layout Design at Qualcomm
by Daniel Payne on 03-31-2012 at 6:54 pm

I first met Betty Pokerwinski of Qualcomm at LinkedIn in the group called IC Layout Designers. I post frequently on LinkedIn and a blog article on an EDA tool called Visual Design Diff from ClioSoft created quite a discussion, enough so that I contacted Betty to learn more about her IC layout group at Qualcomm.

Questions and AnswersRead More


Synopsys Users Group Silicon Valley 2012 Keynote: ARM

Synopsys Users Group Silicon Valley 2012 Keynote: ARM
by Daniel Nenni on 03-28-2012 at 12:49 pm


Keynote #2 at SNUG 2012 was John Cornish, VP Marketing at ARM. Why they sent a marketing person to speak in front of 2,000+ engineers I do not know. To top that, next time they should send a sales person and do a real dog and pony show. To find out more about John I checked his LinkedIn profile which was bare. So enough about John, lets hit … Read More


Synopsys Users Group Silicon Valley 2012 Keynote: Aart de Geus

Synopsys Users Group Silicon Valley 2012 Keynote: Aart de Geus
by Daniel Nenni on 03-27-2012 at 1:26 pm

SNUG Chairman John Busco opened the session with a few words about Aart de Geus, the silver anniversary of Synopsys, and some SNUG statistics. A whopping 2,500 people registered this year! Probably due to the Magma acquisition which is prominently displayed on “Welcome Magma Users” signs and on the flat screens which are everywhere.… Read More


Synopsys Validates EDA360?

Synopsys Validates EDA360?
by Daniel Nenni on 03-26-2012 at 4:26 pm

Before I get too snarky here, I would like to thank Synopsys for the invitation to SNUG 2012 and including me with the professional editors at a 75 minute roundtable discussion with Synopsys CEO Aart de Geus. While Aart is not my favorite big EDA CEO (Wally Rhines of Mentor bought me lunch and returns my email), he is definitely the most… Read More


Synopsys: now in 3D

Synopsys: now in 3D
by Paul McLellan on 03-26-2012 at 8:00 am

And no red and green glasses required.

I remember the first time I heard about a Through Silicon Via (TSV), punching a hole through the entire wafer to make an electrical connection at the back, like we do all the time in printed circuit boards with through plated holes. I thought someone was trying one on and trying to make me look a fool.… Read More


Singapore honors Lip-Bu Tan

Singapore honors Lip-Bu Tan
by Paul McLellan on 03-25-2012 at 11:08 pm

Lip-Bu Tan, the CEO of Cadence, has been named by the Singapore Business Awards as Outstanding CEO (overseas) last week. These awards were launched in 1985 by the Business Times and DHL, so this year is the 27th year of the award, created to recognize business leaders in Singapore and abroad.

As it happens, Cadence flew me first class… Read More


NVM Express: pervasion of PCI Express in SSD based storage

NVM Express: pervasion of PCI Express in SSD based storage
by Eric Esteve on 03-22-2012 at 12:48 pm

The verification IP (VIP) for Non-Volatile Memory Express (NVMe) announcement from Synopsys is the first fruit issued from the acquisition of ExpertIO. With the proliferation of Nand Flash based storage equipment, or Solid State Drives (SSD), the move from pure SATA based solution was to be expected, sooner or later. Not because… Read More


What’s Up with SNUG This Year in Santa Clara?

What’s Up with SNUG This Year in Santa Clara?
by Daniel Payne on 03-22-2012 at 11:04 am

Next week is a big deal because it’s when Synopsys has their annual user group meeting, SNUG in Santa Clara at the Convention Center from Monday through Wednesday. I’d love to hear if they have made any decisions on the new product roadmap after the Magma acquisition, although it’s probably too early to tell.… Read More