Multi Die Webinar 800x100 High Quality
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 3996
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 3996
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Memory Cell Characterization with a Fast 3D Field Solver

Memory Cell Characterization with a Fast 3D Field Solver
by Daniel Payne on 09-29-2011 at 12:07 pm

Memory designers need to predict the timing, current and power of their designs with high accuracy before tape-out to ensure that all the design goals will be met. Extracting the parasitic values from the IC layout and then running circuit simulation is a trusted methodology however the accuracy of the results ultimately depend… Read More


Introducing TLMCentral

Introducing TLMCentral
by Paul McLellan on 09-29-2011 at 8:00 am

Way back in 1999 the open SystemC initiative (OSCI) was launched. In 2005 the IEEE standard for SystemC (IEEE1666-2005 if you are counting) was approved. In 2008, TLM 2.0 was standardized (transactional level models), making building virtual platforms using SystemC models easier. At least the models should be play nicely together,… Read More


Analog IP Design at Moortec

Analog IP Design at Moortec
by Daniel Payne on 09-28-2011 at 12:34 pm

Stephen Crosher started up Moortec in the UK back in 2005 with the help of his former Zarlink co-workers and they set to work offering AMS design services and eventually created their own Analog IP like the temperature sensor shown below:

We spoke by phone last week about his start-up experience and how they approach AMS design.… Read More


Cadence VIP Enables Users to be First-to-Market with Mobile Devices Leveraging Latest MIPI, LPDDR3 and USB 3.0 OTG Standards

Cadence VIP Enables Users to be First-to-Market with Mobile Devices Leveraging Latest MIPI, LPDDR3 and USB 3.0 OTG Standards
by Eric Esteve on 09-27-2011 at 1:56 am

The mobile devices market is simply exploding, with smartphones shipmentgoing up to the sky, tabletsemerging so fast that some people think it will replace PC (but this is still to be confirmed…). This lead mobile SoC designs to integrate increasingly more features, to support customer needs for more computing power and sophisticated… Read More


A Verilog Simulator Comparison

A Verilog Simulator Comparison
by Daniel Payne on 09-22-2011 at 2:40 pm

Intro
Mentor, Cadence and Synopsys all offer Verilog simulators, however when was the last time that you benchmarked your simulator against a tool from a smaller company?

I just heard from an RTL designer (who wants to remain anonymous) about his experience comparing a Verilog simulator called CVC from Tachyon against ModelSim… Read More


Coby Hanoch joins Jasper

Coby Hanoch joins Jasper
by Paul McLellan on 09-20-2011 at 7:00 am

Jasper has hired Coby Hanoch as the VP of international sales to manage sales outside of North America. I talked to him last week.

Coby started his career after graduation from the Israeli Institute of Technology as an engineer at National Semiconductor. He quickly ended up in verification where they developed the first random … Read More


PVT and Statistical Design in Nanometer Process Geometries

PVT and Statistical Design in Nanometer Process Geometries
by Daniel Nenni on 09-18-2011 at 9:00 am

On Sept 22, 2011, the nm Circuit Verification Forumwill be held in Silicon Valley, hosted by Berkeley Design Automation. At this forum, Trent McConaghy of Solido DA will present a case study on the TSMC Reference Flow 2.0 VCO circuit, to showcase Fast PVT in the steps of extracting PVT corners, verifying PVT, and doing post-layout… Read More


Fast Track Seminars

Fast Track Seminars
by Paul McLellan on 09-15-2011 at 6:11 pm


Atrenta’s SoC realization seminars, “Fast Track Your SoC Design” have started.The first one was in Ottowa last Tuesday, and it was a full house. In a straw poll, most of the attendees acknowledged facing IP handoff and quality issues. The keynote speaker was Dr Yuejian Wu, director of ASIC development at Infinera… Read More


Tanner EDA Newsletter – Fall 2011

Tanner EDA Newsletter – Fall 2011
by Daniel Payne on 09-15-2011 at 10:47 am

logo top

From the President: Another Great YearThanks to innovative, cost-effective technology and excellence in customer support, we’ve just ended fiscal year 2011 (on May 31st) with solid growth. Revenue was up 8%, we added 139 new customers, and we’re continuing to reach out to technology partners for MEMS and for the analog and mixed-signalRead More


Simulating in the Cloud

Simulating in the Cloud
by Paul McLellan on 09-13-2011 at 1:43 pm

Yesterday I met with David Hsu who is the marketing guy for Synopsys’s cloud computing solution that they announced at their user-group meeting earlier this year. It was fun to catch up; David used to work for me back in VLSI days although he was an engineer writing place and route software back then.

David admits that this is… Read More