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Electronic Design Automation
Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More
Let’s start with the bottom line: in 14nm processes, errors which have typically been little more than noise with respect to photomask critical dimension (CD) control targets at larger process nodes are about to become very significant, even out of control if not accounted for.… Read More
We have already discussed the recently released M-PCIe ECN from PCI-SIG in Semiwiki at the end of 2012, but the new “standard” (in fact an Engineering Change from PCI-SIG and MIPI Alliance) was only real on paper, at that time. The upcoming webinar from Synopsys, M-PCIe: Utilizing Low-Power PCI Express in Mobile Designs, shows … Read More
LSI is an early adopter of Formality Ultra, Synopsys’s tool for improving the entire ECO flow. I already wrote about the basic capability of the tool here. ECOs are changes that come very late in the design cycle, after place and route has already been “nearly” completed. They occur either due to last minute spec… Read More
Perhaps no area in EDA has been as enigmatic as high-level synthesis (HLS). At nearly every industry event, some new-fangled tool always seems to be tabbed as the next big thing by some analyst or pundit. In a twist, the latest news is on one of the oldest tools – CybeWorkBench.… Read More
Estimating the MTBF of an SoC should always include an analysis of synchronizer reliability. Contemporary process nodes are introducing new challenges to the reliability of clock domain crossings so it is prudent to revisit how your simulation tool calculates a synchronizer’s MTBF. Let’s list the ten most common pitfalls.… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
For several decades now consumers like me have enjoyed using mobile devices including:
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
Did you know that Jasper’s Corner Tap in San Francisco serves Negronis on tap? It’s true. They also have Hanky Panky on tap, which is a Negroni with the Campari replaced with Fernet (which everyone pronounces as Frenet despite it being…well…wrong). And here’s another thing you probably didn’t… Read More
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