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Navigating Resistance Extraction for the Unconventional Shapes of Modern IC Designs

Navigating Resistance Extraction for the Unconventional Shapes of Modern IC Designs
by Nada Tarek on 10-15-2024 at 6:00 am

Fig1 MEMS design

The semiconductor industry is experiencing rapid evolution, driven by the proliferation of IoT applications, image sensors, photonics, MEMS applications, 3DIC and other emerging technologies. This growth has dramatically increased the complexity of integrated circuit (IC) design. One aspect of this complexity is the … Read More


Hearing Aids are Embracing Tech, and Cool

Hearing Aids are Embracing Tech, and Cool
by Bernard Murphy on 10-14-2024 at 6:00 am

earbud2a min

You could be forgiven for thinking of hearing aids as the low end of tech, targeted to a relatively small and elderly audience. Commercials seem unaware of advances in mobile consumer audio, and white-haired actors reinforce the intended audience. On the other hand, the World Health Organization has determined that at least 6%… Read More


CEO Interview: Tobias Ludwig of LUBIS EDA

CEO Interview: Tobias Ludwig of LUBIS EDA
by Daniel Nenni on 10-11-2024 at 6:00 am

IMG 3442 eh

Tobias began his journey with a strong academic foundation in electronic design automation, studying at a leading university in Germany that specialized in formal verification. After graduating, Tobias gained hands-on experience in the semiconductor industry, where he quickly recognized the challenges and inefficiencies… Read More


Webinar: When Failure in Silicon Is Not an Option

Webinar: When Failure in Silicon Is Not an Option
by Daniel Nenni on 10-10-2024 at 6:00 am

background (4)

If the thought of a silicon respin keeps you awake at night, you’re not alone. Re-fabricating a chip can cost tens of millions of dollars. An unplanned respin also risks a delay in getting a product to market, which adds tremendous costs in terms of lost business.

Undoubtedly, adding to your sleep loss is the recent rise in respins.… Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Podcast EP252: A Review of the Q2 2024 SEMI Electronic Design Market Data report with Wally Rhines

Podcast EP252: A Review of the Q2 2024 SEMI Electronic Design Market Data report with Wally Rhines
by Daniel Nenni on 10-07-2024 at 10:00 am

Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. Today he is the Executive Sponsor of the SEMI Electronic Design Market Data Report.

Wally reviews the latest report with Dan. Overall growth was strong at 18.2% vs. Q2 2023. Employment for the sector was also … Read More


The Immensity of Software Development and the Challenges of Debugging (Part 3 of 4)

The Immensity of Software Development and the Challenges of Debugging (Part 3 of 4)
by Lauro Rizzatti on 10-03-2024 at 10:00 am

Immensity of SW development Part 3 Figure 1

Part 3 of this 4-part series analyzes methods and tools involved in debugging software at different layers of the software stack.

Software debugging involves identifying and resolving issues ranging from functional misbehaviors to crashes. The essential requirement for validating software programs is the ability to monitor… Read More


SystemVerilog Functional Coverage for Real Datatypes

SystemVerilog Functional Coverage for Real Datatypes
by Mariam Maurice on 10-03-2024 at 6:00 am

fig 1

Functional coverage acts as a guide to direct verification resources by identifying the tested and untested portions of a design. Functional coverage is a user-defined metric that assesses the extent to which the design specification, as listed by the test plan’s features, has been used. It can be used to estimate the presence… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Is AI-Based RTL Generation Ready for Prime Time?

Is AI-Based RTL Generation Ready for Prime Time?
by Bernard Murphy on 10-02-2024 at 6:00 am

shutterstock 2495413145 min

In semiconductor design there has been much fascination around the idea of using large language models (LLMs) for RTL generation; CoPilot provides one example. Based on a Google Scholar scan, a little over 100 papers were published in 2023, jumping to 310 papers in 2024. This is not surprising. If it works, automating design creation… Read More