As Photonic Integrated Circuits (PIC) continue to gain momentum across datacom, telecom, AI infrastructure, sensing, and quantum computing applications, the need for advanced manufacturing analytics has become increasingly critical. To address the challenges associated with scaling PIC production while maintaining… Read More
Electronic Design Automation
Customized Foundation IP Enables the Next Generation of Automotive Compute
As vehicles become increasingly software-defined, automotive semiconductor suppliers face growing pressure to deliver higher compute performance while maintaining strict requirements for power efficiency, reliability, and long-term product support. Advanced driver assistance systems (ADAS), electrification, … Read More
From Evidence to Authority: Bounded Gate Authority for Governed Semiconductor Realization
Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More
Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die Systems
At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More
Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta
Daniel is joined by Nagesh Gupta, CEO of llmda.ai. Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor. He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators… Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Convergence Evidence Maturity Hierarchy: From Raw Data to Convergence-Authoritative Evidence
The semiconductor industry is generating more engineering data than ever before.
This article follows the previously published GFL and TCG foundation pieces. GFL introduced the lifecycle-governance problem. TCG clarified why observable or interoperable data is not automatically trustworthy convergence evidence. CEMH… Read More
An Update on IP Lifecycle Management (IPLM)
IPLM is not always prominent, nevertheless it is a very necessary aspect of semiconductor (and systems) design. Modern designs build on a wide range of IPs and subsystems, each evolving through multiple variants and versions, each with different PPA characteristics and recommended use-cases, many from different suppliers… Read More
Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them Consistent
Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency. Errors that drive… Read More
Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2P
The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the demand for highly optimized MIPI PHY solutions continues to grow. A key development in this space is the availability… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?