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TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!

TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
by Daniel Nenni on 12-31-2025 at 6:00 am

Synopsys Socionext 3d IC

Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More


Runtime Elaboration of UVM Verification Code

Runtime Elaboration of UVM Verification Code
by Tom Anderson on 12-30-2025 at 6:00 am

AMIQ UVM Runtime Elaboration in DVT IDE

Recently, I reported on my conversation with Cristian Amitroaie, CEO of AMIQ EDA, about automated generation of documentation from design and verification code. Before we chose that topic for a post, Cristian described several capabilities of the AMIQ EDA product family that might be of interest to design and verification engineers.… Read More


CISCO ASIC Success with Synopsys SLM IPs

CISCO ASIC Success with Synopsys SLM IPs
by Daniel Nenni on 12-29-2025 at 10:00 am

cisco silicon one networking 839x473

Cisco’s relentless push toward higher-performance networking silicon has placed extraordinary demands on its ASIC design methodology. As transistor densities continue to rise across advanced SoCs, traditional design-time guardbands are no longer sufficient to ensure long-term reliability, consistent performance,

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Simulating Quantum Computers. Innovation in Verification

Simulating Quantum Computers. Innovation in Verification
by Bernard Murphy on 12-29-2025 at 6:00 am

Innovation New

Quantum algorithms must be simulated on classical computers to validate correct behavior, but this looks very different from classical logic simulation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our… Read More


Assertion-First Hardware Design and Formal Verification Services

Assertion-First Hardware Design and Formal Verification Services
by Kalar Rajendiran on 12-25-2025 at 6:00 am

LUBIS EDA Modelling

Generative AI has transformed software development, enabling entire applications to be built in minutes. But despite similar progress in AI-generated RTL, hardware verification remains a major bottleneck. RTL can be produced quickly, yet proving its correctness is extraordinarily difficult. This has revived a long-standing… Read More


PDF Solutions’ AI-Driven Collaboration & Smarter Decisions

PDF Solutions’ AI-Driven Collaboration & Smarter Decisions
by Kalar Rajendiran on 12-23-2025 at 10:00 am

11 Commandments of AI Application Adoption

When most people hear the term PDF, they immediately think of a PDF file, a universal, platform-independent way to share electronic documents.

There is, however, another PDF that many outside the semiconductor industry may not be familiar with. And this PDF actually predates the PDF file format. It is short for PDF Solutions, … Read More


Bringing Low-Frequency Noise into Focus

Bringing Low-Frequency Noise into Focus
by Admin on 12-23-2025 at 6:00 am

1. Primarius offers a one stop RTN solution

Key takeaways

  • The challenge of acquiring high-quality, reproducible noise data becomes achievable with Primarius’ wafer-level low-frequency noise characterization solution, which is essential for advanced nodes.
  • The Primarius 981X family raises the bar for low-frequency noise measurement metrology with its unique
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Podcast EP323: How to Address the Challenges of 3DIC Design with John Ferguson

Podcast EP323: How to Address the Challenges of 3DIC Design with John Ferguson
by Daniel Nenni on 12-19-2025 at 10:00 am

Daniel is joined by John Ferguson, senior director of product management for the Calibre products in the 3DIC space at Siemens EDA. He manages the vision and product offerings in the Calibre domain for 3DIC design solutions.

Dan explores the challenges of 3DIC and chiplet-based design with John, who describes the broad range of… Read More


How vHelm Delivers an Optimized Clock Network

How vHelm Delivers an Optimized Clock Network
by Mike Gianfagna on 12-19-2025 at 6:00 am

How vHelm Delivers an Optimized Clock Network

In a prior post, I discussed how the clock is no longer just another signal at advanced nodes. Indeed, it is the most critical network on the chip. An optimized clock network can be the margin of victory for your next design. But extracting these benefits is challenging. The clock network is quite sensitive, and optimization can come… Read More


Cost, Cycle Time, and Carbon aware TCAD Development of new Technologies

Cost, Cycle Time, and Carbon aware TCAD Development of new Technologies
by Daniel Nenni on 12-18-2025 at 10:00 am

image001

Our good friend Scotten Jones wrote a paper on a product that has been in joint development with Synopsys and is now available. Scott is currently President Semiconductor Manufacturing Economics and Senior Fellow at TechInsights. Scott and I have discussed this product many times and I feel it is ground breaking technology for… Read More