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In this episode of the Semiconductor Insiders video series, Dan is joined by Brett Larder, co-founder and CTO at March42. Brett explains what March42’s AI technology can do and the benefits of using the platform to quickly analyze designs to find areas that may be out of spec and require more work. He describes the way Mach42… Read More
Key Takeaways
– High-Level Synthesis (HLS) delivers not only design productivity and quality but also dramatic gains in verification speed and debug – and it delivers them today.
– Rise Design Automation uniquely enables SystemVerilog-based HLS and SystemVerilog verification, reusing proven verification… Read More
Transistor fabrication has spanned the gamut from planar devices o FinFET to Gate-All-Around (GAA) as silicon dimensions have decreased in the quest for higher density, faster speeds and lower power. Process development engineers use powerful simulation tools to predict and even optimize transistor performance for GAA devices.… Read More
Digital design engineers have used DFT automation technologies like scan and ATPG for decades now, however, analog blocks embedded within SoCs have historically required that a test engineer write tests that require specialized expertise and that can take man-months to debug. Siemens has a long history in the DFT field, SPICE… Read More
In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More
An engineering change order, or ECO in the context of ASIC design is a way to modify or patch a design after layout without needing to re-implement the design from its starting point. There are many reasons to use an ECO strategy. Some examples include correcting errors that are found in post-synthesis verification, optimizing … Read More
Introduction: The Historical Roots of Hardware-Assisted Verification
The relentless pace of semiconductor innovation continues to follow an unstoppable trend: the exponential growth of transistor density within a given silicon area. This abundance of available semiconductor fabric has fueled the creativity of design… Read More
The concept of built-in self-test for electronics has been around for a while. An article in Electronic Design from 1996 declared that, “built-in self-test (BIST) is nothing new.” The memory subsystem is a particularly large and complex part of any semiconductor design, and it’s one that can be particularly vexing to test. Design… Read More
By Ujjwal Negi – Siemens EDA
Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More
Everyone knows design complexity is exploding. What used to be difficult is now bordering on impossible. While design and verification challenges occupy a lot of the conversation, the problem is much bigger than this. The new design and manufacturing challenges of 3D innovations and the need to coordinate a much more complex … Read More
The 2025 Semi Industry Forum: On the Road to a $1 Trillion Industry