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WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4265
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4265
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)
EDA

Electronic Design Automation

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IMEC and Cadence Disclose 5nm Test Chip

IMEC and Cadence Disclose 5nm Test Chip
by Scotten Jones on 10-09-2015 at 7:00 am
Categories: Cadence, EDA, ESD Alliance, Events

Recently imec and Cadence disclosed that they had fabricated 5nm test chips. This afternoon Dan Nenni and I had a conference call with Praveen Raghavan, principal engineer at imec, and Vassilios Gerousis, distinguished engineer at Cadence to get more details on what the test chip is and what was learned.

First off Vassilios really… Read More

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Cadence Outlines Automotive Solutions at TSMC OIP Event

Cadence Outlines Automotive Solutions at TSMC OIP Event
by Tom Simon on 10-08-2015 at 12:00 pm
Categories: Cadence, EDA, Events, TSMC

I used to joke that my first car could survive a nuclear war. It was a 1971 Volvo sedan (142) that was EMP proof because it had absolutely no semiconductors in the ignition system, just points, condensers and a coil. If you go back to the Model T in 1915 you will see that the “on-board electronics” were not that different. However, today’s… Read More

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Coventor prepping MEMS for CMOS integration

Coventor prepping MEMS for CMOS integration
by Don Dingee on 10-07-2015 at 12:00 pm
Categories: Coventor, EDA

About 11 months ago, I wrote a piece titled “Money for data and your MEMS for free.” In that, I took on the thinking that TSMC is just going to ride into town, fab trillions of IoT sensors, and they all will be 2.6 cents ten years from now. Good headline, but the technology and economics are not that simple. This may be the semiconductor … Read More

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12 Reasons to Attend this Annual User Group Meeting for Transistor-level IC Designers

12 Reasons to Attend this Annual User Group Meeting for Transistor-level IC Designers
by Daniel Payne on 10-07-2015 at 7:00 am
Categories: EDA, MunEDA

My first job out of college was transistor-level circuit design of DRAMs at Intel, so I’ve continued to be fascinated with both the craft and science of designing, optimizing, verifying and debugging custom ICs. Last October I traveled to Munich, Germany to attend a two day user group meeting for engineers using tools from… Read More

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A FinFET BSIM-CMG model update from UC-Berkeley

A FinFET BSIM-CMG model update from UC-Berkeley
by Tom Dillinger on 10-06-2015 at 4:00 pm
Categories: EDA

Every designer relies upon an underlying “compact” device model for circuit simulations – these models are the lifeblood of the IC industry. Designers may not be aware that there is an organization that qualifies models – the Compact Model Coalition – which operates under the umbrella of the Si2 Consortium: http://www.si2.org/cmc_index.php… Read More

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Nine Cost Considerations to Keep IP Relevant –Part2

Nine Cost Considerations to Keep IP Relevant –Part2
by Pawan Fangaria on 10-06-2015 at 7:00 am
Categories: EDA, IP, Semiconductor Services

In the first part of this article I wrote about four types of costs which must be considered when an IP goes through design differentiation, customization, characterization, and selection and evaluation for acquisition. In this part of the article, I will discuss about the other five types of costs which must be considered to enhance… Read More

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Solidly Across the Chasm

Solidly Across the Chasm
by Paul McLellan on 10-05-2015 at 12:00 pm
Categories: EDA, Solido

Last week I wrote about EDA companies crossing the chasm, with Jim Hogan (who needs no introduction) and Amit Gupta, CEO of Solido. So how did those rules work out for Solido?

See also Getting EDA Across the Chasm: 15 Rules Before and 5 After

The founding team of Solido:

  • discovered process variation for analog was a problem as companies
… Read More
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Something Old, Something New…EDA and Verification

Something Old, Something New…EDA and Verification
by Ellie Burns on 10-04-2015 at 12:00 pm
Categories: EDA, Siemens EDA

When I got the opportunity to blog about verification, I thought, what new and interesting things should I talk about? Having started my EDA career in 1983, I often feel like one of the “oldies” in this business…remember when a hard drive required a static strap, held a whopping 33 MB, and was the size of a brick? Perhaps they should … Read More

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Leveraging Synopsys’ Lynx Design System for SoC Designs on Advanced Nodes

Leveraging Synopsys’ Lynx Design System for SoC Designs on Advanced Nodes
by Pawan Fangaria on 10-04-2015 at 7:00 am
Categories: EDA, Synopsys

There was a time when design goals were decided in the beginning, targeted on a particular technology node, design planning done for the same, and implementation done through point tools connected indesign flows customized according to the design. It’s no longer the case for modern SoC designs; there are multiple technology … Read More

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What’s Testing Design Limits at ITC?

What’s Testing Design Limits at ITC?
by Beth Martin on 10-02-2015 at 12:00 pm
Categories: EDA, Siemens EDA

The 46[SUP]th[/SUP] IEEE International Test Conference (ITC) will be held the week of October 5, 2015 at the Disneyland Hotel Conference Center in Anaheim, California. ITC is where you will discover the latest ideas and learn about practical applications of test technologies.

As you take in panels, tutorials, presentations,… Read More