Banner Electrical Verification The invisible bottleneck in IC design updated 1
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The Perfect Wearable SoC…?

The Perfect Wearable SoC…?
by Rick Tewell on 08-23-2016 at 12:00 pm

Power is Everything
During Apollo 13 after the oxygen tank in the service module exploded forcing the crew to use the lunar module as a life boat to get back home, John Aaron – an incredibly gifted NASA engineer who was tasked with getting the Apollo 13 crew back home safely – flatly stated “Power is everything…we’ve… Read More


Did My FPGA Just Fail?

Did My FPGA Just Fail?
by Daniel Payne on 08-22-2016 at 12:00 pm

Designing DRAMs at Intel back in the 1970s I first learned about Soft Errors and the curious effect of higher failure rates of DRAM chips in Denver, Colorado with a higher altitude than Aloha, OR. With the rapid growth of FPGA-based designs in 2016, we are still asking the same questions about the reliability of our chips used for safety-critical… Read More


A New Player in the Functional Verification Space

A New Player in the Functional Verification Space
by Bernard Murphy on 08-22-2016 at 7:00 am

Israel has a strong pedigree in functional verification. Among others, Verisity (an early contributor to class-based testbench design and constrained random testing) started in Israel and RocketTick (hardware-based simulation acceleration), acquired more recently by Cadence, is based in Israel. So when I hear about an … Read More


More on HAPS hybrid prototyping for ARMv8 with Linaro

More on HAPS hybrid prototyping for ARMv8 with Linaro
by Don Dingee on 08-19-2016 at 4:00 pm

A few weeks ago we previewed a Synopsys webinar describing how they are linking the ARM Juno Development Platform with the HAPS-80 and HAPS ProtoCompiler environment. I’ve had a look at the archived event and have some additional thoughts.… Read More


The Package Assembly Design Kit (PADK)… the start of something big

The Package Assembly Design Kit (PADK)… the start of something big
by Tom Dillinger on 08-19-2016 at 12:00 pm

Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More


Foundation IP for Automotive: so Stringent Quality Requirements!

Foundation IP for Automotive: so Stringent Quality Requirements!
by Eric Esteve on 08-19-2016 at 7:00 am

The Automotive IC market is not the largest segment, but is certainly the segments expected to grow with the highest CAGR, with 10.8% from 2013 to 2018, according with IC Insights (January 2015). If you consider the pretty long concept/design to production cycle time (7 years or more) as well as the numerous segments just emerging… Read More


Optimization and verification wins in IoT designs

Optimization and verification wins in IoT designs
by Don Dingee on 08-17-2016 at 4:00 pm

Designers tend to put tons of energy into pre-silicon verification of SoCs, with millions of dollars on the line if a piece of silicon fails due to a design flaw. Are programmable logic designers, particularly those working with an SoC such as the Xilinx Zynq, flirting with danger by not putting enough effort into verification?… Read More


Solido Saves Silicon with Six Sigma Simulation

Solido Saves Silicon with Six Sigma Simulation
by Tom Simon on 08-16-2016 at 4:00 pm

When pushing the boundaries of power and performance in leading edge memory designs, yield is always an issue. The only way to ensure that memory chips will yield is through aggressive simulation, especially at process corners to predict the effects of variation. In a recent video posted on the Solido website, John Barth of Invecas… Read More


Are Your Transistor Models Good Enough?

Are Your Transistor Models Good Enough?
by Daniel Payne on 08-16-2016 at 12:00 pm

SoC designers can now capture their design ideas with high-level languages like C and SystemC, then synthesize those abstractions down into RTL code or gates, however in the end the physical IC is implemented using cell libraries made up of transistors. Circuit designers use simulation tools like SPICE on these transistor-level… Read More


Semi execs look at IoT tradeoffs a bit differently

Semi execs look at IoT tradeoffs a bit differently
by Don Dingee on 08-15-2016 at 4:00 pm

What happens when you get a panel of four executives together with an industry-leading journalist to discuss tradeoffs in IoT designs? After the obligatory introductions, Ed Sperling took this group into questions on power, performance, and integration.… Read More