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Machine Learning and EDA!

Machine Learning and EDA!
by Daniel Nenni on 04-21-2017 at 7:00 am

Semiconductor design is littered with complex, data-driven challenges where the cost of error is high. Solido’s new ML (machine learning) Labs, based on Solido’s ML technologies developed over the last 12 years, allows semiconductor companies to collaboratively work with Solido in developing new ML-based EDA products.

Data… Read More


Webinar: Getting to Formal Coverage

Webinar: Getting to Formal Coverage
by Bernard Murphy on 04-20-2017 at 10:00 am

Facing rapidly growing challenges in getting to respectable coverage, designers have been turning more and more to formal verification, not just to plug gaps but increasingly to take over verification of significant components of the testplan. Which is great, but at the end of the day any approach to verification must be measured… Read More


Virtual Reality

Virtual Reality
by Bernard Murphy on 04-20-2017 at 7:00 am

In the world of hardware emulators, virtualization is a hot and sometimes contentious topic. It’s hot because emulators are expensive, creating a lot of pressure to maximize return on that investment through multi-user sharing and 24×7 operation. And of course in this cloud-centric world it doesn’t hurt to promote cloud-like… Read More


Autonomous Vehicles: Tesla, Uber, Lyft, BMW, Intel and Mentor Graphics

Autonomous Vehicles: Tesla, Uber, Lyft, BMW, Intel and Mentor Graphics
by Daniel Payne on 04-19-2017 at 12:00 pm

I read at least one hour of news every day to keep informed, and I’ve read so many stories about autonomous vehicles that the same, familiar company names continue to dominate the thought leadership. What really caught my attention this month was an announcement about autonomous vehicle technology coming from Mentor GraphicsRead More


The Importance of EM, IR and Thermal Analysis for IC Design – Webinar

The Importance of EM, IR and Thermal Analysis for IC Design – Webinar
by Daniel Payne on 04-17-2017 at 4:00 pm

Designing an IC has both a logical and physical aspect to it, so while the logic in your next chip may be bug-free and meet the spec, how do you know if the physical layout will be reliable in terms of EM (electro-migration), IR (voltage drops) and thermal issues? EDA software once again comes to our rescue to perform the specific type… Read More


A New Product for DRC and LVS that Lives in the Cloud

A New Product for DRC and LVS that Lives in the Cloud
by Daniel Payne on 04-17-2017 at 12:00 pm

Back in the day the Dracula tool from Cadence was king of the DRC and LVS world for physical IC verification, however more recently we’ve seen Calibre from Mentor Graphics as the leader in this realm. Cadence wanted to reclaim their earlier prominence in physical verification so they had to come out with something different… Read More


How to Implement a Secure IoT system on ARMv8-M

How to Implement a Secure IoT system on ARMv8-M
by Daniel Payne on 04-14-2017 at 12:00 pm

This weekend my old garage door opener started to fail, so it was time to shop for a new one at The Home Depot, and much to my surprise I found that Chamberlain offered a Smartphone-controlled WiFi system. Just think of that, controlling my garage door with a Smartphone, but then again the question arose, “What happens when a … Read More


IP Traffic Control

IP Traffic Control
by Bernard Murphy on 04-14-2017 at 7:00 am

From an engineering point of view, IP is all about functionality, PPA, fitness for use and track record. From a business/management point of view there are other factors, just as critical, that relate less to what the IP is and more to its correct management and business obligations. The problems have different flavors depending… Read More


SPIE 2017 ASML and Cadence EUV impact on place and route

SPIE 2017 ASML and Cadence EUV impact on place and route
by Scotten Jones on 04-13-2017 at 7:00 am

As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More