100X800 Banner (1)
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4360
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4360
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Why Open and Supported Interfaces Matter

Why Open and Supported Interfaces Matter
by Mitch Heins on 08-29-2017 at 12:00 pm

Back in the early 1980’s during the nascent years of electronic design automation (EDA), I worked at Texas Instruments supporting what would become their merchant ASIC business. Back then, life was a bit different. The challenge we faced was to make our ASIC library available on as many EDA flows as we could to give as many users as… Read More


Analysis and Signoff for Restructuring

Analysis and Signoff for Restructuring
by Bernard Murphy on 08-29-2017 at 7:00 am

For the devices we build today, design and implementation are unavoidably entangled. Design for low-power, test, reuse and optimized layout are no longer possible without taking implementation factors into account in design, and vice-versa. But design teams can’t afford to iterate indefinitely between these phases, so they… Read More


Customizable Analog IP No Longer a Pipe Dream

Customizable Analog IP No Longer a Pipe Dream
by Tom Simon on 08-28-2017 at 12:00 pm

Configurable analog IP has traditionally been a tough nut to crack. Digital IP, of course, now provides for wide configurability for varying applications. In the same way that analog design has remained less deterministic as compared to digital design, analog IP has also tended to be less flexible. However, the tide may be turning… Read More


Bluetooth 5 IP is Ready for SoC Integration

Bluetooth 5 IP is Ready for SoC Integration
by Eric Esteve on 08-28-2017 at 7:00 am

Bluetooth®, WiFi, LTE, and 5G technologies enable wireless connectivity for a range of applications. While each offer unique features and advantages, designers need now to decide which protocol to integrate in a single chip after having test the market by using wireless off-chip solutions. Bluetooth 5 builds upon the success… Read More


Oracle is out of the Chip Business!

Oracle is out of the Chip Business!
by Daniel Nenni on 08-26-2017 at 7:00 am

This is a story I have been tracking for some time now. Oracle is one of the companies I was enamored with early in my career, Sun microsystems as well. They are both legacies here in Silicon Valley, absolutely. I can now confirm that Oracle is getting out of the chip business. Oracle got into the chip business with the $7.4B acquisition… Read More


Samsung, Synopsys and Qualcomm at DAC

Samsung, Synopsys and Qualcomm at DAC
by Daniel Payne on 08-24-2017 at 12:00 pm

I’m a user of many Samsung products as my family has Samsung Galaxy smart phones and my MacBook Pro uses Samsung SSD for storage, so at DAC I attended a breakfast panel with presenters from Samsung, Synopsys and Qualcomm. This was the second day of DAC and they served us breakfast, and with the big names on the panel the room was… Read More


A Functional Safety Primer for FPGA – the White Paper

A Functional Safety Primer for FPGA – the White Paper
by Bernard Murphy on 08-23-2017 at 7:00 am

Following up on their webinar on functional safety in FPGA-based designs, Synopsys have now published a white paper expanding on some of those topics. For those who didn’t get a chance to see the webinar this blog follows the white paper flow and is similar but not identical to my webinar blog, particularly around differences between… Read More


Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications

Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications
by Mitch Heins on 08-22-2017 at 12:00 pm

Calling all ASIC designers working on High-Bandwidth Memory (HBM) access architectures in high-performance computing (HPC), networking, deep learning, virtual reality, gaming, cloud computing and data center applications. You won’t want to miss this upcoming webinar focused on system integration aspects of a HBM2 ASIC… Read More


HBM offers SOC’s dense and fast memory options

HBM offers SOC’s dense and fast memory options
by Tom Simon on 08-22-2017 at 7:00 am

Dual in-line memory modules (DIMM’s ) with double data rate synchronous dynamic random access memory (DDR SDRAM) have been around since before we were worried about Y2K. Over the intervening years this format for provisioning memory has evolved from supporting DDR around 1995, to DDR1 in 2000, DDR2 in 2003, DDR4 in 2007 and DDR4… Read More


Extraction Features for 7nm

Extraction Features for 7nm
by Tom Dillinger on 08-21-2017 at 12:00 pm

Frequent Semiwiki readers are familiar with the importance of close collaboration between the foundries and EDA tool developers, to provide the crucial features required by new process nodes. Perhaps the best illustration of the significance of this collaboration is the technical evolution of layout parasitic extraction.… Read More