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TechCon: See ANSYS and TSMC co-present

TechCon: See ANSYS and TSMC co-present
by Bernard Murphy on 10-12-2017 at 7:00 am

ANSYS and TSMC will be co-presenting at ARM TechCon on Multiphysics Reliability Signoff for Next Generation Automotive Electronics Systems. The event is on Thursday October 26th, 10:30am-11:20am in Grand Ballroom B.


You can get a free Expo pass which will give you access to this event HERE and see the session page for the event … Read More


A better way to combine PVT and Monte Carlo to improve yield

A better way to combine PVT and Monte Carlo to improve yield
by Tom Simon on 10-11-2017 at 12:00 pm

TSMC held its Open Innovation Platform Forum the other week on September 13[SUP]th[/SUP]. Each year the companies that exhibit at this event choose to highlight their latest technology. One of the most interesting presentations that I received during the event was from Solido. In recent years they have produced a number of groundbreaking… Read More


An IIot Gateway to the Cloud

An IIot Gateway to the Cloud
by Bernard Murphy on 10-10-2017 at 7:00 am

A piece of learning we all seem to have gained from practical considerations of IoT infrastructure is that no, it doesn’t make sense to ship all the data from an IoT edge device to the cloud and let the cloud do all the computational heavy lifting. On the face of it that idea seemed good – all those edge devices could be super cheap (silicon… Read More


Webinar on Electrochemistry and how it affects Semiconductor devices

Webinar on Electrochemistry and how it affects Semiconductor devices
by Daniel Payne on 10-09-2017 at 12:00 pm

My educational background is Electrical Engineering and I’ve learned a lot since starting in the industry back in 1978 while working on bipolar, NMOS and CMOS technology, designing DRAM, data controller and GPU devices. I continue to learn about the semiconductor industry through daily reading and attending trade shows… Read More


An Informal Update

An Informal Update
by Bernard Murphy on 10-05-2017 at 7:00 am

I mentioned back in June that Synopsys had launched a blog on formal verification, intended to demystify the field and provide help in understanding key concepts. It’s been a few months, time to check in on some of their more recent posts.


First up, it feels like they are finding their groove. Relaxed style, useful topics but now with… Read More


Is there anything in VLSI layout other than pushing polygons? (2)

Is there anything in VLSI layout other than pushing polygons? (2)
by Dan Clein on 10-04-2017 at 12:00 pm

One of the important changes that happen between 1984 and 1988 is the hardware platforms development. Calma evolved, mainframe S140 with 2 combined monitors per terminal in S280 with 2 individual monitors per terminal. This meant that from noisy and darker rooms we move to more quiet and lighted rooms. We doubled the speed and theRead More


Photonics Summit Delivers High-Bandwidth Discussion on State of Silicon Photonics

Photonics Summit Delivers High-Bandwidth Discussion on State of Silicon Photonics
by Mitch Heins on 10-03-2017 at 12:00 pm

On September 6, 2017, Cadence Design Systems, Lumerical Solutions and PhoeniX Software hosted their second Photonics Summit. As with last year’s summit, this was a two-day event, with the first day including in a myriad of photonics presentations and the second day being a hands-on workshop. The hands-on workshop taught attendees… Read More


Adoption, Architecture and Origami

Adoption, Architecture and Origami
by Bernard Murphy on 10-03-2017 at 7:00 am

Last week I sat in on Oski’s latest in a series of “Decoding Formal” sessions. Judging by my first experience, they plan and manage these events very well. Not too long (~3 hours of talks), good food (DishDash), good customer content, a good forward-looking topic and a very entertaining wrap-up talk.… Read More


TSMC Teamwork Translates to Technical Triumph

TSMC Teamwork Translates to Technical Triumph
by Tom Simon on 10-02-2017 at 12:00 pm

Most people think that designing successful high speed analog circuits requires a mixture of magic, skill and lots of hard work. While this might be true, in reality it also requires a large dose of collaboration among each of the members of the design, tool and fabrication panoply. This point was recently made abundantly clear … Read More


Design for Manufacturability Analysis for PCB’s

Design for Manufacturability Analysis for PCB’s
by Tom Dillinger on 09-29-2017 at 7:00 am

Chip designers are familiar with the additional physical design checking requirements that were incorporated into flows at advanced process nodes. With the introduction of optical correction and inverse lithography technology applied during mask data generation, and with the extension of a 193nm exposure source to finerRead More