Synopsys Multi Die Webinar 800x100
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Takeaways from SNUG 2023

Takeaways from SNUG 2023
by Bernard Murphy on 04-07-2023 at 6:00 am

Aart keynote

Synopsys pulled out all the stops for this event. I attended the first full day, tightly scripted from Aart’s keynote kick off to 1×1 interviews with Synopsys executives to a fireside chat between Sassine Ghazi (President and COO) and Rob Aitken (ex-Fellow at Arm, now Distinguished Architect at Synopsys). That’s a lot of … Read More


Chiplets, is now their time?

Chiplets, is now their time?
by Daniel Nenni on 03-31-2023 at 6:00 am

P3221015 cropped

Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon CatalystRead More


The Rise of the Chiplet

The Rise of the Chiplet
by Kalar Rajendiran on 03-28-2023 at 10:00 am

Open Chiplet Economy

The emergence of chiplets as a technology is an inflection point in the semiconductor industry. The potential benefits of adopting a chiplets-based approach to implementing electronic systems are not a debate. Chiplets, which are smaller, pre-manufactured components can be combined to create larger systems, offering benefits… Read More


Checklist to Ensure Silicon Interposers Don’t Kill Your Design

Checklist to Ensure Silicon Interposers Don’t Kill Your Design
by Dr. Lang Lin on 03-20-2023 at 10:00 am

Image1

Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More


Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More


Speeding up Chiplet-Based Design Through Hardware Emulation

Speeding up Chiplet-Based Design Through Hardware Emulation
by Kalar Rajendiran on 02-16-2023 at 10:00 am

Barriers on the Continuum to SiP

The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More


Alphawave Semi at the Chiplet Summit

Alphawave Semi at the Chiplet Summit
by Daniel Nenni on 02-03-2023 at 6:00 am

Alphawave Semi Chiplet Summit

The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More


Who will Win in the Chiplet War?

Who will Win in the Chiplet War?
by Daniel Nenni on 01-16-2023 at 6:00 am

Chiplet APEC

The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!

“The First Annual Chiplet… Read More


The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Kalar Rajendiran on 12-27-2022 at 6:00 am

High End Performance Packaging Spectrum

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More


Chiplets UCIe Require Verification

Chiplets UCIe Require Verification
by Daniel Nenni on 12-20-2022 at 6:00 am

UCIe VIP Truechip

Chiplets have been trending on SemiWiki for the past two years and I think that will continue into the distant future. As a potential way to unclog Moore’s Law, you can bet the semiconductor ecosystem will prove once again to be a chiplet force of nature driving semiconductor company roadmaps to smaller and better things.

To be clear,… Read More