As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome. And don’t forget to come see us at DVCon,… Read More
Artificial Intelligence
Formal Datapath Verification for ML Accelerators
Formal methods for digital verification have advanced enormously over the last couple of decades, mostly in support of verification in control and data transport logic. The popular view had been that datapath logic was not amenable to such techniques. Control/transport proofs depend on property verification; if a proof is … Read More
Siemens Aspires to AI in PCB Design
This. AI in PCB design is not a new idea. Other PCB software companies also make that claim. But when a mainstream systems technology company like Siemens talks about the subject, that is noteworthy. They already have an adaptive user interface (UI) for their mechanical modeling suite and to assist in low-code development for application… Read More
Webinar: Flexible, Scalable Interconnect for AI HW System Architectures
Building next generation systems is a real balancing act. The high-performance computing demands presented by increasing AI an ML content in systems means there are increasing challenges for power consumption, thermal load, and the never-ending appetite for faster data communications. Power, performance, and cooling … Read More
Pushing Acceleration to the Edge
As more AI applications turn to edge computing to reduce latencies, the need for more computational performance at the edge continues to increase. However, commodity compute engines don’t have enough compute power or are too power-hungry to meet the needs of edge systems. Thus, when designing AI accelerators for the edge, Joe… Read More
Quadric’s Chimera GPNPU IP Blends NPU and DSP to Create a New Category of Hybrid SoC Processor
Performance, Power and Area (PPA) are the commonly touted metrics in the semiconductor industry placing PPA among the most widely used acronyms relating to chip development. And rightly so as these three metrics greatly impact all electronic products that are developed. The degree of impact depends of course on the specific … Read More
New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development
Without data, there is no computing field to talk about, no technology world to awe at and not much of a semiconductor industry to work in. There is no argument that data is the foundational piece for everything, has been to date and will continue to be. While processing an application’s input data is essential to serve the intended… Read More
Test Ordering for Agile. Innovation in Verification
Can we order regression tests for continuous integration (CI) flows, minimizing time between code commits and feedback on failures? Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas.… Read More
Arm and Arteris Partner on Automotive
Whenever a new partnership is announced, the natural question is, “why?” What will this partnership make possible that wasn’t already possible with those two companies working independently? I talked yesterday with Frank Schirrmeister of Arteris on the partnership. (Yes, Frank is now at Arteris). And I just got off an Arm press… Read More
Semifore is Supplying Pain Relief for Some World-Changing Applications
In a recent post, I discussed how Samtec is fueling the AI revolution. In that post, I talked about how smart everything seems to be everywhere, changing the way we work, the way we think about our health and ultimately improving life on the planet. These are lofty statements, but the evidence is growing that the newest wave of applications… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet