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Ceva recently unveiled its XC21 and XC23 DSP cores, designed to revolutionize wireless communications and edge AI processing. These new offerings build upon the Ceva-XC20 architecture, delivering unmatched efficiency, scalability, and performance for 5G-Advanced, pre-6G, and smart edge applications. As demand grows … Read More
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More
Peter was running late for two reasons. First, he encountered unexpected heavy traffic and arrived ten minutes late for a crucial meeting with a customer to run a compliance test of his new 6G phone design prototyped on FPGAs. This prototype’s success was pivotal, as it could secure a significant purchase order.… Read More
In the fast-paced world of Electronic Design Automation (EDA), the complexity of chip designs is continuously rising. With the burgeoning of systems such as 5G communication devices and Advanced Driver-Assistance Systems (ADAS) teeming with thousands of components, the demand for robust and efficient prototyping platforms… Read More
I am a fan of product releases which bundle together multiple high-value advances. That approach reduces the frequency of releases (no bad thing) in exchange for more to offer per release, better proven through solid partner validation. The Dynamic Duo III release falls in this class, offering improvements in performance, capacity,… Read More
After owning general purpose compute in cell phones and IoT devices, it wasn’t clear what Arm’s next act might be. Seemingly the x86 giants dominated in datacenters and auguries suggested a bloody war in smaller platforms between Arm and RISC-V. But Arm knew what they were doing all along, growing upwards into infrastructure:… Read More
Low earth orbit (LEO) satellites as an intermediary for communication became hot when Elon Musk announced Starlink (yeah, other options were available, but Elon Musk). This capability extends internet availability to remote areas and notably (for a while) to Ukraine in support of the war with Russia. Satellites can in principle… Read More
There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More
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Rethinking Multipatterning for 2nm Node