ASML Update SEMICON West 2023

ASML Update SEMICON West 2023
by Scotten Jones on 07-27-2023 at 10:00 am

12494 34 Bart Smeets Supporting future DRAM overlay and EPE roadmaps with the NXT2100i Page 21

At SEMICON West I had a chance to catch up with Mike Lercel of ASML. In this article I am going to combine ASML presentation material from the SPIE Advanced Lithography Conference, Mike’s SEMICON presentation, my discussions with Mike at SEMICON and a few items from ASML’s recent earnings call.

DUV

ASML continues to improve DUV systems.… Read More


Intel Internal Foundry Model Webinar

Intel Internal Foundry Model Webinar
by Scotten Jones on 06-21-2023 at 12:00 pm

IAO Investor Webinar Slides to post on our INTC website PDF Page 07

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.

On a humorous note, the person moderating the attendee questions sounded … Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More


Applied Materials Announces “EPIC” Development Center

Applied Materials Announces “EPIC” Development Center
by Scotten Jones on 06-07-2023 at 8:00 am

Applied Materials EPIC briefing under embargo Page 10

On May 22nd Applied Materials announced a new development center, Equipment and Process Innovation and Commercialization Center (EPIC).

Applied Materials already operates the Maydan Technology Center (MTC), a billion-dollar development facility with over 120 advanced process tools and 80 metrology and inspection tools… Read More


SPIE 2023 – imec Preparing for High-NA EUV

SPIE 2023 – imec Preparing for High-NA EUV
by Scotten Jones on 05-17-2023 at 6:00 am

Figure 1 Pellicle Transmission

The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.

I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More


TSMC has spent a lot more money on 300mm than you think

TSMC has spent a lot more money on 300mm than you think
by Scotten Jones on 04-06-2023 at 10:00 am

Slide1

Up until November of 2022, IC Knowledge LLC was an independent company and had become the world leader in cost and price modeling of semiconductors. In November 2022 TechInsights acquired IC Knowledge LLC and IC Knowledge LLC is now a TechInsights company.

For many years, IC Knowledge has published a database tracking all the 300mm… Read More


SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement

SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement
by Scotten Jones on 03-13-2023 at 8:00 am

Applied Materials Sculpta Presentation for Media Page 06

The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing … Read More


IEDM 2023 – 2D Materials – Intel and TSMC

IEDM 2023 – 2D Materials – Intel and TSMC
by Scotten Jones on 02-20-2023 at 6:00 am

Slide1

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More


IEDM 2022 – Imec 4 Track Cell

IEDM 2022 – Imec 4 Track Cell
by Scotten Jones on 01-18-2023 at 6:00 am

2022 IEDM Presentation Session23 2 VictorVega Page 03

At the IEDM conference in December 2022, Imec presented “Semi-damascene Integration of a 2-layer MOL VHV Scaling Booster to Enable 4-track Standard Cells,” I had a chance to not only read the paper and see it presented, but also to interview one of the authors Zsolt Tokie.

Logic designs are built up by standard cells such as inverters,… Read More


IEDM 2022 – TSMC 3nm

IEDM 2022 – TSMC 3nm
by Scotten Jones on 01-02-2023 at 6:00 am

TSMC CPP

TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.

When … Read More