About a decade ago, semiconductor designs had just a few asynchronous clocks which were easily managed by designers through the process of manual design reviews. The situation today is completely different. An SoC can have hundreds of asynchronous clocks, driving different complex functions, spread across various IPs, supplied… Read More
Author: Pawan Fangaria
FinFET Based Designs Made Easy & Reliable
Although semiconductor manufacturing has taken off with FinFET based process technology which provides lucrative payoffs on performance improvement, power reduction and area saving in devices for high density and high performance SoC demand of modern era, apprehensions remain about its reliability due to reduced noise … Read More
A Re-look at TI’s Businesses, Strategies & Future
In recent days I’ve seen several long discussions about Texas Instrumentslosing its grip in semiconductor industry when it came out of a business it was strong in, i.e. wireless business. It seems the semiconductor community has not digested the fact that TI, very rightly, came out of the OMAP business at the right time. The smartphone… Read More
Ceaseless Field Test for Safety Critical Devices
While focus of the semiconductor industry has shifted to DACin this week and unfortunately I couldn’t attend due to some of my management exams, in my spare time I was browsing through some of the webpages of Cadenceto check their new offerings (although they have a great list of items to showcase at DAC) and to my pleasure I came across… Read More
RedHawk Excels – Customers Endorse
Since a few years, I have been following up Ansys Apachetools for semiconductor design, verification and sign-off. RedHawk is the most prominent platform of tools from Ansys, specifically for Power, Noise and Reliability Sign-off. It has witnessed many open endorsements from several of Ansyscustomers through open presentations,… Read More
Virtual Fabrication: Not just for fabs. Fabless companies can benefit from more visibility into process technology
Ever since I started talking about Virtual Fabrication I have mostly looked at it from the manufacturers’ perspective, where it has obvious benefits to develop and model new process technology. But what about the fabless design concept and indeed even the semiconductor IP world that has spawned from it as well? It seems that Virtual… Read More
A Collaborative Approach Yields Better PI for PCBs
The power integrity (PI) of a system is an extremely important aspect to be looked at all levels – chip, package and PCB for overall reliability of the system. At the PCB level, a DC analysis, usually based on IR drop, must ensure that adequate DC voltage, satisfying all constraints of current density and temperature, is delivered… Read More
Concept Engineering Showcases Effective SoC Debugging Techniques
In a complex environment of semiconductor design where an SoC can have several millions of gates and multiple number of IPs at different levels of abstractions from different sources integrated together, it becomes really difficult to understand and debug the overall SoC design. Of course, along with the SoC integration, optimization… Read More
Taming The Challenges of SoC Testability
With the advent of large SoCs in semiconductor design space, verification of SoCs has become extremely challenging; no single approach works. And when the size of an SoC can grow to billions of gates, the traditional methods of testability of chips may no longer remain viable considering the needs of large ATPG, memory footprint,… Read More
New Frontiers in MEMS and Their Enablers
With the 51[SUP]st[/SUP] DACapproaching quickly, I spent some time last week-end to look around about what new trends, technologies and innovations will be most talked about during DAC. Every year, I find some exciting new technologies in the semiconductor industry and the overall semiconductor ecosystem that get wider exposure… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay