How Many Licenses Do You Buy?

How Many Licenses Do You Buy?
by Paul McLellan on 07-23-2012 at 6:16 pm

An informal survey of RTDA customers reveals that larger companies tend to buy licenses based on peak usage while smaller companies do not have that luxury and have to settle for fewer licenses than they would ideally have and optimize the mix of licenses that they can afford given their budget. Larger companies get better prices… Read More


EUV: No Pellicle

EUV: No Pellicle
by Paul McLellan on 07-22-2012 at 10:00 pm

There’s a dirty secret problem about EUV that people don’t seem to to be talking about. There’s no pellicle on a EUV mask. OK, probably you have no idea what that means, a lot of jargon words, nor why it would be important, but it seems to me it could be the killer problem for EUV.

In refractive masks, you print a pattern… Read More


Directed Self Assembly

Directed Self Assembly
by Paul McLellan on 07-19-2012 at 9:00 pm

At Semicon, Ben Rathsack of Tokyo Electron America talked about directed self assembly (DSA) at the standing-room only lithography morning. So what is it? Self assembly involves taking two monomers that don’t mix and letting them polymerise (so like styrene forming polystyrene). Since they won’t mix they will … Read More


EDAC Announces EDA up 6.3% in Q1 versus 2011

EDAC Announces EDA up 6.3% in Q1 versus 2011
by Paul McLellan on 07-17-2012 at 11:24 pm

EDAC announced that EDA industry revenue increased 6.3% for Q1 2012 to $1536.9M compared to a year ago. Sequentially it declined, as it normally does from Q4 to Q1, by 9.6%. Every category except services increased revenue and every region increased revenue except for Japan. The full report is available by subscription, of course.… Read More


EUV Masks

EUV Masks
by Paul McLellan on 07-17-2012 at 11:00 pm

This is really the second part to this blog about the challenges of EUV lithography. The next speaker was Franklin Kalk who is CTO of Toppan Photomasks. He too emphasized that we can make almost arbitrarily small features but more and more masks are required (not, that I suspect, he would complain being in the mask business). For EUV… Read More


3D Thermal Analysis

3D Thermal Analysis
by Paul McLellan on 07-17-2012 at 11:32 am

Matt Elmore of ANSYS/Apache has an interesting blog posting about thermal analysis in 3D integrated circuits. With both technical and economic challenges at process nodes as we push below 28nm, increasingly product groups are looking towards through-silicon-via (TSV) based approaches as a way of keeping Moore’s law… Read More


Laker Analog Prototyping

Laker Analog Prototyping
by Paul McLellan on 07-16-2012 at 6:18 pm

Over the years many attempts have been made to increase the level of automation in analog design. Most of these have not been especially successful. Probably part of the reason was inadequate technology but also there is an attitude that “real” analog designers design polygons on the bare silicon. I think two things… Read More


Extreme Ultra Violet (EUV)

Extreme Ultra Violet (EUV)
by Paul McLellan on 07-15-2012 at 8:15 pm

EUV is the great hope for avoiding having to go to triple (and more) patterning if we have to stick with 193nm light. There were several presentations at Semicon about the status of EUV. Here I’ll discuss the issues with EUV lithography and in a separate post discuss the issues about making masks for EUV.

It is probably worth … Read More


Silicon on Insulator (SOI)

Silicon on Insulator (SOI)
by Paul McLellan on 07-14-2012 at 5:51 pm

I attended a panel session followed by a party during Semicon to celebrate Soitec’s 20th birthday. Officially it was titled An Insider’s Look at the Future of Mobile Technologies. But in reality it was a look at the future possibilities for SOI.

Silicon on Insulator (SOI) has been a sort of bastard child of semiconductor.… Read More


Direct Write E-beam

Direct Write E-beam
by Paul McLellan on 07-13-2012 at 2:08 pm

One of the presenters at the standing-room only litho session at Semicon this week was Serge Tedesco, the litho program manager at CEA-Leti in Grenoble France. He is running a program called IMAGINE for maskless lithography. Chips today are built using a reticle (containing the pattern for that layer of the chip) which is exposed… Read More