Going up…3D IC design tools

Going up…3D IC design tools
by Paul McLellan on 01-23-2012 at 6:41 pm

3D and 2.5D (silicon interposer) designs create new challenges for EDA. Not all of them are in the most obvious areas. Mentor has an interesting presentation on what is required for verification and testing of these types of designs. Obviously it is somewhat Mentor-centric but in laying out the challenges it is pretty much agnostic.… Read More


Acquiring Great Power

Acquiring Great Power
by Paul McLellan on 01-20-2012 at 5:11 pm

“Before we acquire great power we must acquire wisdom to use it well”
Ralph Waldo Emerson

Making good architectural decisions for controlling power consumption and ensuring power integrity requires a good analysis of the current requirements and how they vary. Low power designs, and today there really aren’t… Read More


Apple 4S nearly catches up to Android, perhaps

Apple 4S nearly catches up to Android, perhaps
by Paul McLellan on 01-19-2012 at 4:00 am

Apple’s iPhone did well in Q4 according to Neilsen who polled recent buyers of smartphones. Of people who had purchased a smartphone in the previous 3 months (roughly Q4) 44.5% chose an iPhone (up from 25.1% in October, roughly Q3). But Android retained the lead with a 46.9% share, down from 61.6% in October. How many phones… Read More


Addressing the Challenges of Tomorrow’s SoC Design

Addressing the Challenges of Tomorrow’s SoC Design
by Paul McLellan on 01-17-2012 at 5:28 pm

For the next few days Atrenta is running a series of 30 minute live webinars to discuss the new solutions and approaches that are required to improve the way SoC designs are created and modified.

The webinars are at the following times:

  • Jan 17th, 7-7.30am PST (sorry you missed that one)
  • January 18th 7.30-8pm PST (and January 19th in
Read More

Chip-Package-System workshops

Chip-Package-System workshops
by Paul McLellan on 01-17-2012 at 4:30 pm

Chips, packages and circuit boards (systems, hence CPS) used to be three separate domains with their own tools that barely interacted at all. If you were lucky, reassigning a pin on a package wouldn’t have to be done manually in all 3 places. But now, from a signal integrity, noise, power point of view these three domains must… Read More


#49 Design Automation Conference Deadlines

#49 Design Automation Conference Deadlines
by Paul McLellan on 01-14-2012 at 10:53 pm

Note that there are several DAC deadlines coming up in the next couple of weeks.

The deadline for user track submissions is January 17th (next Tuesday). Submission requires an extended abstract. See here for details.

The deadline for DAC workshops is January 19th (next Thursday). A proposal is required. See here for details.

The… Read More


Needham growth conference

Needham growth conference
by Paul McLellan on 01-13-2012 at 6:00 am

One of the fun things when a company gets big but is still private, like Atrenta, is that you start to get invited to events like the Needham Growth Conference that took place earlier this week in New York. When I ran Compass Design Automation, which at the time was about $55M in revenue, I remember going to a couple of these events. At … Read More


EDAC reports Q3

EDAC reports Q3
by Paul McLellan on 01-12-2012 at 7:49 pm

EDAC (EDA consortium) market statistics service announced the data for Q3 of 2011. Revenue increased 18.1% (versus 2010) to $1543.9 million. Sequentially (versus Q2) revenue increase 7.4%. Annualized, that puts EDA at over $6B for, I belive, the first time ever. Wally Rhines, who is EDAC chair (and CEO of Mentor) commented that… Read More


Speeding SoC timing closure

Speeding SoC timing closure
by Paul McLellan on 01-12-2012 at 1:42 am

As chips have become larger, one of the more challenging steps is full-chip signoff. Lots of other steps in the design process can work on just a part of the problem, but by definition full-chip signoff has to work on the full chip. But it is not just that chips have got larger, the number of corners that need to be validated has also exploded.… Read More


Medfield: ARM twisting

Medfield: ARM twisting
by Paul McLellan on 01-11-2012 at 2:53 pm

One of the most significant announcements at the consumer electronics show (CES) this week was Intel’s Medfield, an Atom-based smartphone SoC. The SoC itself is unremarkable, perhaps a little better than ARM Cortex-based SoCs in some areas, worse in others. The reason it is significant is that Motorola (soon to be Google,… Read More