Rugged Security Solutions For Evolving Cybersecurity Threats

Rugged Security Solutions For Evolving Cybersecurity Threats
by Kalar Rajendiran on 11-30-2023 at 6:00 am

Secure IC Stockphoto.jpg

Secure-IC is a global leader in end-to-end cybersecurity solutions, specializing in the domain of embedded systems and connected devices. With an unwavering commitment to pushing the boundaries of security innovation, Secure-IC has established a remarkable track record. Its credentials include active involvement in new… Read More


A Complete Guidebook for PCB Design Automation

A Complete Guidebook for PCB Design Automation
by Kalar Rajendiran on 11-29-2023 at 8:00 am

Constraint Management

Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More


Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability

Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability
by Kalar Rajendiran on 11-27-2023 at 6:00 am

Synopsys 224G SerDes IP InterOp Multiple Tradeshows

Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More


Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing

Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
by Kalar Rajendiran on 11-21-2023 at 10:00 am

CEVA Comprehensive Edge AI Portfolio

The surge in Edge AI applications has propelled the need for architectures that balance performance, power efficiency, and flexibility. Architectural choices play a pivotal role in determining the success of AI processing at the edge, with trade-offs often necessary to meet the unique demands of diverse workloads. There are… Read More


Successful 3DIC design requires an integrated approach

Successful 3DIC design requires an integrated approach
by Kalar Rajendiran on 11-13-2023 at 6:00 am

Siemens EDA 3DIC Graphics

While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More


Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems

Unlocking the Power of Data: Enabling a Safer Future for Automotive Systems
by Kalar Rajendiran on 11-06-2023 at 10:00 am

SDVs New Monetization Opportunities

The automotive industry is undergoing a major transformation; it is not about just connectivity and convenience anymore. Data is emerging as the driving force behind innovation and safety with vehicles becoming sophisticated data-driven machines. By unlocking the power of data, we can create safer vehicles and roads and usher… Read More


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers

100G/200G Electro-Optical Interfaces: The Future for Low Power, Low Latency Data Centers
by Kalar Rajendiran on 10-23-2023 at 6:00 am

112G Ethernet PHY IP EOE InterOp Demo JR5 0179

Electrical copper interconnects, once the backbone of data center networks, are facing growing challenges. Rapid expansion of AI and ML applications is driving a significant increase in cluster sizes within data centers, resulting in substantial demands for faster I/O capabilities. While the surge in I/O requirements is … Read More


Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem

Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
by Kalar Rajendiran on 10-10-2023 at 10:00 am

L.C. OIP 2023

As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More


Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design

Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design
by Kalar Rajendiran on 10-10-2023 at 6:00 am

AresCORE UCIe PHY Support for All Package Types

The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More