We all know that designers work hard to reach design closure on SOC designs. However, what gets less attention from consumers is the effort that goes into ensuring that these chips will be fully operational and meeting timing specs over their projected lifetime. Of course, this is less important for chips used in devices with projected… Read More
Author: Daniel Nenni
Webinar: Simulate Trimming for Circuit Quality of Smart IC Design
Advanced semiconductor nanometer technology nodes, together with smart IC design applications enable today very complex and powerful systems for communication, automotive, data transmission, AI, IoT, medical, industry, energy harvesting, and many more.
However, more aggressive time-to-market and higher performance… Read More
Alphawave IP and the Evolution of the ASIC Business
Alphawave IP has agreed to acquire OpenFive, a SiFive business unit (formerly Open-Silicon) for $210m in cash. Having spent many years in the ASIC business which included working with Open-Silicon, Alphawave, and OpenFive here is my perspective on the acquisition:
This acquisition accomplishes two things: First it trims down… Read More
CEO Interview: Aki Fujimura of D2S
Curvilinear Design Primer for Design, Packaging Communities
This interview was done by Bob Smith, Executive Director, ESD Alliance, a SEMI Technology Community.
Previously, Fujimura served as CTO at Cadence Design Systems and returned to Cadence for the second time through the acquisition of Simplex Solutions where he was… Read More
Webinar: From Glass Break Models to Person Detection Systems, Deploying Low-Power Edge AI for Smart Home Security
Moving deep learning from the cloud to the edge is the holy grail when it comes to deploying highly accurate, low-power applications. Market demand for edge AI continues to grow globally as new hardware and software solutions are now more readily available, enabling any sized company to easily implement deep learning solutions… Read More
5G Network Activation Update
As a pilot and semiconductor professional I was a bit shocked to get an Airworthiness Directive due to the 5G rollout. Airworthiness Directives are legally enforceable regulations issued by the FAA to correct an unsafe condition in a product:
“Airworthiness Directive (AD) 2021-23-12 was issued for all fleets in December… Read More
CEO Interview: Frankwell Lin, Chairman and CEO of Andes Technology
Frankwell Lin, Chairman of Andes Technology, started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working… Read More
How Intel will Beat Samsung
Now that Intel is back in the foundry business, and with the Tower Semiconductor acquisition they are definitely back in the foundry business, Samsung will be the biggest foundry loser here.
You can break the IDM foundry business into two parts: First, and foremost, the NOT TSMC Business. Second is the the Better PPA (Power/Performance,… Read More
Prototype enables new synergy – how Artosyn helps their customers succeed
Artosyn Microelectronics, a leading provider of AI SoCs for drones and other sophisticated applications finds itself at the intersection of hardware architecture and software development. “Our customers are advancing the state of AI programming every day,” said Shen Sha, Senior R&D Manager of Artosyn’s AI Chip Department.… Read More
Integrating Materials Solutions with Alex Yoon of Intermolecular
I had a follow-on discussion with Alex Yoon from our podcast last year. He is as a Head of Strategic and Emerging Technologies and partnerships at Intermolecular, part of EMD electronics.
Prior to joining EMD electronics, he was Senior Technical Director at Lam Research, led activities in emerging memory and novel materials … Read More

		        
			
			
			
			
			
			
			
			
			
			






Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business