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With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.
Which is certainly… Read More
As we all know design starts are the life blood of the semiconductor industry, both big and small. Enabling those design starts is what the semiconductor ecosystem is all about and Efabless has a very unique value proposition in this regard.
Efabless is a free cloud-based chip design platform, growing community of 9000+ chip designers,… Read More
As I sift through mounds of semiconductor press releases trying to figure out the relevance (with mixed results) I consider it a learning experience even when they don’t really tell me anything. This one however tells me two very important things:
1) Arm is a much more competitive company with the new leadership. I saw a noticeable… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.
There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More
Mobiveil Marks 11th Anniversary
Ravi Thummarukudy is Mobiveil’s Chief Executive Officer and a founder. He and I recently spent an enjoyable afternoon getting acquainted as I learned more about Mobiveil. It’s an inspiring story of a technology company in the semiconductor space helping customers and prospering.
Eleven-year-old… Read More
TSMC also covered manufacturing excellence. The TSMC “Trusted Foundry” tagline has many aspects to it, but manufacturing is a critical one. TSMC is the foundry capacity leader but there is a lot more to manufacturing as you will read here. Which brings us to the manufacturing accomplishments from the briefing:
TSMC covered their specialty technologies in great detail. Specialty is what we inside the ecosystem used to call weird stuff meaning non-mainstream and fairly difficult to do on leading edge processes. Specialty technologies will play an even more important part of semiconductor design with the advent of chiplets where die… Read More
TSMC’s 3DFabric initiative was a big focus at the symposium, as it should be. I remember when TSMC first went public with CoWos the semiconductor ecosystem, including yours truly, let out a collective sigh wondering why TSMC is venturing into the comparatively low margin world of packaging. Now we know why and it is absolutely… Read More
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TSMC vs Intel Foundry vs Samsung Foundry 2026