Shanghai, July 19, 2025 — S2C, a leader in functional verification, showcased its latest digital EDA solutions and key partnerships with BOSC, Xuantie, and Andes Technology at RISC-V Summit China 2025, highlighting its contributions to the ecosystem. The company also played a leading role in the EDA sub-forum, with VP Ying… Read More
Author: Daniel Nenni
S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China
Should Intel be Split in Half?
A recent commentary from four former Intel board members argue that Intel should be split into two separate companies with separate CEOs and separate board of directors. Charlene Barshefsky, Reed Hundt, James Plummer, and David Yoffie wrote that Intel shareholders should insist on a split which would create a new, independent,… Read More
CEO Interview with Karim Beguir of InstaDeep
Karim Beguir is InstaDeep’s Chief Executive Officer. He helps companies get to grips with the latest AI breakthroughs and deploy these in order to improve efficiency and ROI. As a graduate of France’s Ecole Polytechnique and former Program Fellow at NYU’s Courant Institute, Karim has a passion for teaching and using… Read More
Making Intel Great Again!
Lip-Bu Tan made it very clear on his most recent call that Intel will not continue to invest in leading edge semiconductor manufacturing solo. Lip-Bu is intimately familiar with TSMC and that is the collaborative business model he envisions for Intel Foundry. I support this 100%. Intel and Samsung have tried to compete head-to-head… Read More
Unlocking Efficiency and Performance with Simultaneous Multi-Threading
An Akeana hosted webinar on Simultaneous Multi-Threading (SMT) provided a comprehensive deep dive into the technical, commercial, and strategic significance of SMT in the evolving compute landscape. Presented by Graham Wilson and Itai Yarom, the session was not only an informative overview of SMT architecture and use cases,… Read More
UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era
The Universal Chiplet Interconnect Express (UCIe) 3.0 specification marks a decisive step in the industry’s shift from monolithic SoCs to modular, multi-die systems. Released on August 5, 2025, the new standard doubles peak link speed from 32 GT/s in UCIe 2.0 to 48 and 64 GT/s while adding a suite of manageability and efficiency
CEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices
Avi Madisetti is the CEO and Founder of Mixed-Signal Devices, a fabless semiconductor company delivering multi-gigahertz timing solutions. A veteran of Broadcom and Rockwell Semiconductor, Avi helped pioneer DSP-based Ethernet and SerDes architectures that have shipped in the billions. He later co-founded Mobius Semiconductor,… Read More
Materials Selection Methodology White Paper
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
Formal Verification: Why It Matters for Post-Quantum Cryptography
Formal verification is becoming essential in the design and implementation of cryptographic systems, particularly as the industry prepares for post-quantum cryptography (PQC). While traditional testing techniques validate correctness over a finite set of scenarios, formal verification uses mathematical proofs to guarantee… Read More
CEO Interview with Bob Fung of Owens Design
Bob Fung is the CEO of Owens Design, a Silicon Valley company specializing in the design and build of complex equipment that powers high-tech manufacturing. Over his 22-year tenure, Bob has led the development of more than 200 custom systems for world-class companies across the semiconductor, biomedical, energy, and emerging… Read More
Semiconductor Equipment Spending Healthy