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There is an interesting discussion on the LinkedIn SoC Power Integrity Group in regards to the power integrity challenges for high speed and high frequency designs. More specifically, the additional attention an on-chip power delivery network (PDN) requires as the operating frequency of ICs and SoCs increases.
The PDN has to… Read More
At advanced process nodes, variation and its effects on the design become a huge challenge. Join Cadence® Virtuoso® experts for a series of technical webinars on variation-aware design. Learn how to use advanced technologies and tools to analyze and understand the affects of variation. We’ll introduce you to the latest Virtuoso… Read More
Silicon Creations will be presenting a paper with Berkeley Design Automation at the TSMC Open Innovation Platform (OIP) Ecosystem Forum next week where TSMC’s design ecosystem member companies and customers share real-case solutions for design challenges within TSMC’s design ecosystem:
This presentation will describe … Read More
Qualcomm VP of Engineering, Charlie Matar, will be keynoting the Apache/ANSYS seminar in Santa Clara next Thursday. Charlie is a great guy and a great speaker so you won’t want to miss this and it’s FREE! I spoke to Charlie, he will be speaking on:
Today’s complex SOC design is driven by the constant demand for high performance… Read More
It’s all about the silicon. It’s all about silicon correlation. TSMC Open Integration Platform should be renamed TSMC Silicon Correlation Platform or TSMC SCP. One of the problems I have with EDA technical papers today is that they are not silicon based. Anybody can put up slides with marketing sparkles on them but if you want qualified… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
DAC’s technical program offers the best-in-class solutions that promise to advance Electronic Design Automation (EDA) and Embedded Systems and Software (ESS). DAC 2013 is seeking submissions that deal with design technologies and algorithms, addressing all aspects of electronic design across several submission categories.… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem. More than 90% of the attendees last year said “this… Read More
Learn everything you need to know about processors for enterprise- and carrier-communications systems. We have added more Speakers and industry experts and expanded the two-day conference program with 25 % more sessions.
We will be featuring presentations on the newest processors with multiple cores, programmable data planes,… Read More
Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet