Will the Package Kill my High-Frequency Chip Design?

Will the Package Kill my High-Frequency Chip Design?
by Bryan Preble on 01-02-2024 at 6:00 am

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Understanding the electromagnetic (EM) coupling between various elements of a high-frequency semiconductor device is vital for meeting design specifications and ensuring reliable operation in the field. These EM interactions include not only the silicon chip but also extend to the package that encloses it. However, it may… Read More