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ProteanTecs Logo SemiWiki
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Webinar: The Data Revolution of Semiconductor Production

Webinar: The Data Revolution of Semiconductor Production
by Daniel Nenni on 02-27-2023 at 6:00 am

Webinar Promotional Graphics linkedin 800x100How Advancements in Technology Unlock New Insights

The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.

Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from QualcommMicrosoft Azure and Advantest as we discuss how data analytics and product insights can accelerate time to market and improve performance, yield and quality.

Topics covered: 

  • Overcoming data siloes
  • Processing massive amounts of data
  • Using machine learning and advanced data analytics
  • Uncovering data insights and actionable intelligence

Panel will be moderated by Nitza Basoco, VP of Business Development at proteanTecs. Nitza has a broad background in management, test development, product engineering, supply chain and operations. In her current role, she focuses on partnership strategies and ecosystem growth, positioning proteanTecs as the common data language to the full value chain. Before joining proteanTecs, she was VP of Operations at Synaptics and held engineering and leadership positions at Teradyne, Broadcom and MaxLinear. Nitza earned a BSEE and MEEE from MIT.

Register now and save your seat.

Meet Our Panelists

ProteanTecs Webinar semiconductor production

Michael Campbell is Senior Vice President of Engineering for Qualcomm CDMA Technologies, responsible for product and test, failure analysis, test automation and yield. Mike joined Qualcomm in 1996 and has led multiple teams. In his current role, he is working to streamline all processes impacting time-to-market, new process node enablement, and revolutionize product test engineering (PTE) tasks by driving machine learning as a 21st century requirement. Prior to joining Qualcomm, Mike worked at Mostek, INMOS and Honeywell. He holds a BSEE/CE from Clarkson University.

Preeth Chengappa is Head of Industry for the EDA and Semiconductor segment at Azure. Since joining Microsoft in 2018, he has worked with customers and partners across the semiconductor ecosystem to leverage cloud capabilities for all aspects of design, manufacturing, testing and lifecycle management. Preeth co-founded SiCAD in 2011, a startup that pioneered the use of cloud computing for chip design. Previously, Preeth held business development and sales management roles at Xilinx, Altran and Falcon Computing. He holds a BS in engineering from NITK, India.

Ira Leventhal is the Vice President of Applied Research & Technology at Advantest America, Inc. He has over 25 years of experience in semiconductor testing, including memory, SoC, wireless device, and system-level test. Ira has led the design and development of multiple generations of ATE systems, and holds patents in a variety of test-related technologies. In his current role, Ira is focusing on how artificial intelligence, cloud, and data analytics technologies can be catalysts for major advances in semiconductor test products and methodologies. Ira is a BSEE graduate of MIT.

Register now and save your seat.

Post-Webinar Q&A: The Data Revolution of Semiconductor Production

About proteanTecs

proteanTecs is the leading provider of deep data analytics for advanced electronics monitoring. Trusted by global leaders in the datacenter, automotive, communications and mobile markets, the company provides system health and performance monitoring, from production to the field.  By applying machine learning to novel data created by on-chip monitors, the company’s deep data analytics solutions deliver unparalleled visibility and actionable insights—leading to new levels of quality and reliability. Founded in 2017 and backed by world-leading investors, the company is headquartered in Israel and has offices in the United States, India and Taiwan. For more information, visit www.proteanTecs.com.

Also Read:

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface

Elevating Production Testing with proteanTecs and Advantest’s ACS Edge™ Platforms

How Deep Data Analytics Accelerates SoC Product Development

CEO Interview: Shai Cohen of proteanTecs

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