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WEBINAR: Reclaiming Clock Margin at 3nm and Below

WEBINAR: Reclaiming Clock Margin at 3nm and Below
by Daniel Nenni on 03-17-2026 at 8:00 am

Webinar Blog Image Reclaiming Clock Margin

At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.

That assumption no longer holds

As supply… Read More


The First Real RISC-V AI Laptop

The First Real RISC-V AI Laptop
by Jonah McLeod on 03-17-2026 at 6:00 am

DC ROMA

At a workshop in Boston on February 27, something subtle but important happened. Developers sat down in front of a RISC-V laptop, installed Fedora, and ran a local large language model. No simulation. No dev board tethered to a monitor. A laptop.

For more than a decade, RISC-V advocates have promised that the open instruction set… Read More


AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent

AI-Driven Automation in Semiconductor Design: The Fuse EDA AI Agent
by Daniel Nenni on 03-16-2026 at 1:30 pm

The semiconductor industry is experiencing unprecedented growth in complexity as advanced process nodes, heterogeneous integration, and AI-driven workloads demand increasingly sophisticated chip designs. At the same time, semiconductor companies face rising design costs, increasing engineering workloads, and a shrinking… Read More


TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation

TSMC Technology Symposium 2026: Advancing the Future of Semiconductor Innovation
by Daniel Nenni on 03-16-2026 at 10:00 am

TSMC Technology Symposium 2026

One of my favorite times of the year is coming (sailing season) and my favorite event of the year is coming as the company I most respect will host the best international semiconductor networking event starting here in Silicon Valley.

The 32nd annual TSMC Technology Symposium represents one of the most influential events in the … Read More


Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026
by Mike Gianfagna on 03-16-2026 at 6:00 am

Synopsys Explores AI:ML Impact on Mask Synthesis at SPIE 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More


Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment

Unraveling Dose Reduction in Metal Oxide Resists via Post-Exposure Bake Environment
by Daniel Nenni on 03-15-2026 at 4:00 pm

Unraveling Dose Reduction in Metal Oxide Resists via Post Exposure Bake Environment

In the realm of extreme ultraviolet (EUV) lithography, metal oxide resists (MORs) have emerged as promising candidates for advanced semiconductor patterning. However, their stability poses challenges, particularly interactions with clean-room environments like humidity and airborne molecular contaminants (AMCs) … Read More


CEO Interview with Dr. Mohammad Rastegari of Elastix.AI

CEO Interview with Dr. Mohammad Rastegari of Elastix.AI
by Daniel Nenni on 03-15-2026 at 2:00 pm

mohammad headshot

Mohammad Rastegari is a prominent AI researcher and entrepreneur currently serving as the CEO and Co-Founder of Elastix.AI. Based in the Greater Seattle Area, he also holds the position of Affiliate Assistant Professor at the University of Washington’s Electrical & Computer Engineering Department. His professional… Read More


Tesla and Samsung Relationship Update

Tesla and Samsung Relationship Update
by Daniel Nenni on 03-15-2026 at 8:00 am

Elon Musk Lip Bu Tan Wafer Deal

The majority of my 40+ year career has been spent managing the relationship between leading-edge semiconductor design and manufacture, working with just about every commercial foundry and top customer in one way or another. It’s my thing—it fascinates me. I’m also a fan of disruption, and the latest disruptions the semiconductor… Read More


Podcast EP335: The Far Reaching Impact of UCIe with Dr. Debendra Das Sharma

Podcast EP335: The Far Reaching Impact of UCIe with Dr. Debendra Das Sharma
by Daniel Nenni on 03-13-2026 at 10:00 am

Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More


Agentic AI and the Future of Engineering

Agentic AI and the Future of Engineering
by Daniel Nenni on 03-13-2026 at 6:00 am

sassine announces agentic ai hires converge 2026

Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are now dealing with… Read More