Mohit Gupta founded TYLsemi to build chiplet-based intelligent power and connectivity solutions for AI infrastructure—an area where custom silicon has long been underserved. TYLsemi exists to provide the foundational chiplet platform that enables tailored custom silicon solutions for the evolving needs of AI infrastructure.… Read More
DAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.Accellera Systems Initiative invites the design and verification…Read More
Enabling AI to Understand Complex Runtime Behavior for Accurate, Automated Root Cause Analysis — DAC 2026Undo gives AI coding agents the runtime context…Read MorePodcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy
Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics… Read More
CEO Interview with Madhulima Tewari of VerifAIX
Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI system aimed at helping… Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging
There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:
Jeff Su: I guess very simply put, EMIB-T, in his view, is… Read More
TSMC’s Raises the Bar on CAPEX!
On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for the 2027 TSMC CAPEX is an incredible… Read More
Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and … Read More
WAVE-P: Hardware Acceleration for the APV Professional Video Codec
Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026
Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure, and… Read More




TSMC CoWoS versus Intel EMIB Semiconductor Packaging