The first article in this series examined how feasibility exploration (hyperlink to SemiWiki first article) enables architects to evaluate multi-die system configurations while minimizing early design risk. Once architectural decisions are validated, designers must translate conceptual connectivity requirements … Read More
Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon SecurityIn a significant advancement for the semiconductor industry,…Read More
Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic EngineeringAt the 2026 Chiplet Summit, Synopsys presented a…Read More
An Agentic Formal Verifier. Innovation in VerificationIn a break from our academic-centric picks, here…Read More
Reimagining Compute in the Age of Dispersed IntelligenceAt the 2025 RISC-V Summit, amid debates over…Read More
Siemens to Deliver Industry-Leading PCB Test Engineering SolutionsSiemens has strengthened its position in EDA and…Read MoreCHERI: Hardware-Enforced Capability Architecture for Systematic Memory Safety
The rapid escalation of cyberattacks over the past two decades has exposed a fundamental weakness at the core of modern computing systems: the lack of memory safety. Industry data consistently shows that the majority of critical software vulnerabilities stem from memory corruption issues such as buffer overflows, use-after-free… Read More
WEBINAR: Two-Part Series on RF Power Amplifier Design
At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More
Securing RISC-V Third-Party IP: Enabling Comprehensive CWE-Based Assurance Across the Design Supply Chain
by Jagadish Nayak
RISC-V adoption continues to accelerate across commercial and government microelectronics programs. Whether open-source or commercially licensed, most RISC-V processor cores are integrated as third-party IP (3PIP), potentially introducing supply chain security challenges that demand structured,… Read More
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More
Another Quantum Topic: Quantum Communication
In my recent series on quantum computing (QC), I intentionally overlooked a couple of adjacent topics: quantum communication and quantum sensing. These face some of the same challenges as QC, however I noticed a recent report on a test quantum network implemented by Cisco and Qunnect which led me to find more from Cisco on their … Read More
Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
CEO Interview with Echo Yang of CSCERAMIC
Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development, Echo leads… Read More
Podcast EP333: A Look at the Broad, Worldwide Impact SEMI Has on the Semiconductor Industry with Ajit Manocha
Daniel is joined by Ajit Manocha, president and CEO of SEMI, the global industry association serving the semiconductor and electronics manufacturing and design supply chain. Throughout his career, Manocha has been a champion of industry collaboration as a critical means of advancing technology for societal and economic prosperity.… Read More
Memory Matters: Signals from the 2025 NVM Survey
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More


Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability