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If You Struggle with Up-To-Date Documentation llmda.ai Can Help

If You Struggle with Up-To-Date Documentation llmda.ai Can Help
by Mike Gianfagna on 05-21-2026 at 10:00 am

If You Struggle with Up To Date Documentation llmda.ai Can Help

Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency. Errors that drive… Read More


Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes

Bronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
by Daniel Nenni on 05-21-2026 at 8:00 am

BroncoBlogPostDetective

A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.

Bronco … Read More


Europe is Getting Serious About ASIC Innovation

Europe is Getting Serious About ASIC Innovation
by Bernard Murphy on 05-21-2026 at 6:00 am

European ASIC Startups

I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale, the Nordic economic model is taking … Read More


Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More


Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips

Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
by Daniel Nenni on 05-20-2026 at 8:00 am

Semidynamics Secures a Strategic Investment

In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More


Quantum Gathering Momentum Amid Concerns for the Grid

Quantum Gathering Momentum Amid Concerns for the Grid
by Bernard Murphy on 05-20-2026 at 6:00 am

Quantum attack on the power grid

I posted recently on an eye-catching advance in quantum computing, around neutral atom systems which might accelerate the transition to production-grade fault-tolerant quantum computing (QC). There are some further updates on this front, also I listened in on a panel considering quantum-based hacking vulnerability in the… Read More


PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026

PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
by Daniel Nenni on 05-19-2026 at 10:00 am

PQSNews Ultra small Embedded World

As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More


Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)

Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)
by Moh Kolb on 05-19-2026 at 8:00 am

PictureGFL

The semiconductor industry has achieved extraordinary mastery in silicon signoff. Modern EDA environments can now optimize timing closure, physical verification, IR/EM behavior, routing density, thermal interaction, and increasingly even design-space exploration through AI-assisted implementation flows. Crossing… Read More


imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling

imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
by Daniel Nenni on 05-19-2026 at 6:00 am

TSMC 3DFabric Alliance Expansion Signals New Era of System Level Scaling

imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More


Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting

Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting
by Admin on 05-18-2026 at 10:00 am

Crossing the Yield Cliff IDP V6 and the Future of Manufacturing Forecasting

The paper, Industrial Defectivity Prediction (IDP) V6: A Two-Layer Yield Cliff Framework for Cross-Industry Mass-Production Forecasting, presents a generalized industrial yield-modeling architecture that extends the classical Negative Binomial framework through a two-layer phenomenological structure designed … Read More