IMGTC Webinar SemiWIki

Agentic AI Is Reshaping Semiconductor Design

Agentic AI Is Reshaping Semiconductor Design
by Daniel Nenni on 09-21-2026 at 10:00 am

ChipAgents DAC2026

Artificial intelligence is moving rapidly from an experimental aid to a foundational part of semiconductor engineering. In a recent industry talk, leaders from ChipAgents and Analog Devices described how agentic AI could help chipmakers manage soaring design complexity, accelerate product development, and improve the … Read More


The Future of CPO May Be a Glass Integration Platform

The Future of CPO May Be a Glass Integration Platform
by Moh Kolb on 09-21-2026 at 8:00 am

CPO on a glass patfrom

Co-packaged optics is usually described as a proximity problem.

Move the optical engine closer to the switch ASIC or XPU. Shorten the electrical path. Reduce SerDes power. Increase bandwidth density.

That direction is real.

Optical functionality is moving progressively closer to compute.

But proximity does not eliminate … Read More


Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips

Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips
by Daniel Nenni on 09-21-2026 at 6:00 am

Analog Bits Targets the Power Challenge at the Heart of Next Generation Chips

Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.

The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More


The Technical Problem Is Often Not the Business Problem

The Technical Problem Is Often Not the Business Problem
by Admin on 09-20-2026 at 10:00 am

image2

By Prof. Dr. S. Filo Ambrosini

On a semiconductor line, a rising defect rate can trigger a familiar debate. Do we need a new inspection system? More sensors? An additional engineer?

Those may all be valid responses. But before making the decision, someone needs to establish when the change began, where it first appears, and whether… Read More


Broadcom’s AI Engine Shifts Into Overdrive

Broadcom’s AI Engine Shifts Into Overdrive
by Daniel Nenni on 09-20-2026 at 8:00 am

The XPU Effect Broadcom AI

Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More


Executive Interview with Raghu Belur, Co-Founder of Enphase Energy

Executive Interview with Raghu Belur, Co-Founder of Enphase Energy
by Daniel Nenni on 09-20-2026 at 6:00 am

Raghu Belur bcolor (002)

Raghu co-founded Enphase Energy with Martin Fornage in 2006. He has more than 25 years of experience in the clean energy and high‑technology industries, and has been at the forefront of developing Enphase’s leading integrated energy system—with solar generation, storage, monitoring, and control. Prior to Enphase, Raghu developed

Read More

Podcast EP367: How Keysight is Accelerating RF and Microwave Design with Matthew Ozalas

Podcast EP367: How Keysight is Accelerating RF and Microwave Design with Matthew Ozalas
by Daniel Nenni on 09-18-2026 at 10:00 am

Daniel is joined by Matthew Ozalas from Keysight. With an experience of more than 20 years, Matthew brings a plethora of knowledge in complex RF designs using CAD tools.   Matthew has also authored several application notes on RF and Microwave design and development using Keysight ADS with his recent ones based on “Artificial … Read More


TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders
by Daniel Nenni on 09-18-2026 at 8:00 am

TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win Orders

TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More


CEO Interview with Charlie Cheng of CEO of TeRAM

CEO Interview with Charlie Cheng of CEO of TeRAM
by Daniel Nenni on 09-18-2026 at 6:00 am

Charlie Cheng Headshot

Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More


The Invisible Bottleneck Is Costing You Time You Can’t Get Back

The Invisible Bottleneck Is Costing You Time You Can’t Get Back
by Admin on 09-17-2026 at 8:00 am

invisible bottle neck package


By Joel Jorgensen, FlowAccel.

The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More