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Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering

Moving Beyond AI-Assisted Design – Agentrys Shows the Way with Agentic Loop Engineering
by Mike Gianfagna on 10-19-2026 at 12:00 pm

Agentic Loops, Autonomous Chip Design

At Hot Chips 2026, OpenAI presented Jalapeño, an inference ASIC built with AI in the design loop. As reported from the session by ServeTheHome and Tom’s Hardware, OpenAI showed measured block-level wins over a human baseline — 56% on a BF16 multiply, alongside a 10% smaller matrix-unit area — within a roughly nine-month path from… Read More


ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results

ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified Results
by Daniel Nenni on 10-19-2026 at 10:00 am

chipagents announcement

ChipAgents is expanding its agentic AI platform across digital and analog semiconductor engineering, aiming to connect fragmented design workflows through a common system that can plan tasks, operate engineering tools and evaluate results.

The Santa Clara company says its IC-Star engine combines organizational design … Read More


Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity

Rethinking Phase Jitter: An Algorithmic Approach to Signal Integrity
by Admin on 10-19-2026 at 8:00 am

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Byline: Richard Shreiner

​Modern semiconductor architectures are pushing the absolute limits of physical scaling. As data rates climb into sub-picosecond regimes across high-performance computing, 5G/6G infrastructure, and advanced AI clusters, physical layer (Layer 1) signal integrity has shifted from an engineering… Read More


Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips

Siemens and NVIDIA Accelerate Lithography for Next-Generation AI Chips
by Daniel Nenni on 10-19-2026 at 6:00 am

Accelerating Lithography for AI Chips

Siemens has announced advances in its collaboration with NVIDIA to accelerate computational lithography, addressing a demanding step in manufacturing advanced AI semiconductors. By integrating NVIDIA’s cuLitho library with Siemens Calibre manufacturing software, the companies aim to make sophisticated photomask optimization… Read More


CEO Interview with Francisco Almada Lobo of Critical Manufacturing

CEO Interview with Francisco Almada Lobo of Critical Manufacturing
by Daniel Nenni on 10-18-2026 at 10:00 am

Industrial AI in semiconductor manufacturing

Francisco Almada Lobo is CEO and co-founder of Critical Manufacturing. He began his career at a CIM research institute and joined Siemens Semiconductors in 1997. In 2004 he led the migration of an MES in a running high-volume facility, and from 2005 to 2009 he managed the Porto Development Center for Infineon and Qimonda, responsible… Read More


Maskless EUV Lithography: An Alternative to E-Beam

Maskless EUV Lithography: An Alternative to E-Beam
by Admin on 10-18-2026 at 8:00 am

Maskless EUV Lithography An Alternative to E Beam

Semiconductor manufacturing depends on lithography: the process of transferring tiny circuit patterns onto a silicon wafer. Conventional extreme-ultraviolet (EUV) lithography projects light with a wavelength of 13.5 nanometers through a reflective optical system, using a custom photomask to define each layer. It can … Read More


CEO Interview with Dr. Raj Talluri of Kulicke & Soffa

CEO Interview with Dr. Raj Talluri of Kulicke & Soffa
by Daniel Nenni on 10-18-2026 at 6:00 am

Connecting the Future of Chips

Dr. Talluri joined K&S in August 2026 as a member of the Board and assumed the role of President and Chief Executive Officer of K&S in September 2026. Prior to joining K&S, Dr. Talluri served as President, Chief Executive Officer and a member of the Board of Directors at Enovix Corporation, a Nasdaq-listed advanced … Read More


Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server

Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server
by Daniel Nenni on 10-16-2026 at 10:00 am

Daniel is joined by Nir Sever, an industry veteran with over 30 years of technological and managerial experience in advanced VLSI engineering. Before joining proteanTecs, Nir served for 10 years as the COO of Tehuti Networks, a pioneer in the area of high-speed networking Semiconductors. Prior to that, he served for 9 years as … Read More


TSMC’s AI Expansion Signals a Broader Shift in Computing

TSMC’s AI Expansion Signals a Broader Shift in Computing
by Daniel Nenni on 10-16-2026 at 8:00 am

TSMC’s AI expansion

TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More


Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
by Admin on 10-16-2026 at 6:00 am

Single Roof, Connected Silicon

By Shaurya Seth

Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets 100,000 wafer… Read More