Synopsys 800x100 px High Quality

TSMC CoWoS versus Intel EMIB Semiconductor Packaging

TSMC CoWoS versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-17-2026 at 8:00 am

TSMC CoWoS verus Intel EMIB

There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:

Jeff Su: I guess very simply put, EMIB-T, in his view, isRead More


TSMC’s Raises the Bar on CAPEX!

TSMC’s Raises the Bar on CAPEX!
by Daniel Nenni on 07-17-2026 at 6:00 am

TSMC CAPEX 2026 SemiWiki

On the latest investor call the big story was the increase in CAPEX for 2026 and the expected CAPEX for 2027. TSMC raised the CAPEX ceiling for 2026 from US$56 billion to US$64 billion. My guess would be US$64 billion will be spent if not more. We have been discussing this in the SemiWiki Forum and my guess for 2027 TSMC CAPEX is and incredible… Read More


Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC

Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC
by Daniel Nenni on 07-16-2026 at 2:00 pm

Agentrys DAC Plan

Agentrys is pioneering Agentic Design Automation (ADA), a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms. Today, frontier AI can automate many engineering tasks by understanding specifications, generating RTL and … Read More


WAVE-P: Hardware Acceleration for the APV Professional Video Codec

WAVE-P: Hardware Acceleration for the APV Professional Video Codec
by Daniel Nenni on 07-16-2026 at 10:00 am

WAVE P Chips&Media

Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional and prosumer… Read More


PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Kalar Rajendiran on 07-16-2026 at 6:00 am

PCIe7 Switch with TDM

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking devices optimized… Read More


DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!

DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!
by Daniel Nenni on 07-15-2026 at 2:00 pm

Dac Banner

Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More


Perforce Enabling Innovation Without Introducing Risk at DAC 2026

Perforce Enabling Innovation Without Introducing Risk at DAC 2026
by Daniel Nenni on 07-15-2026 at 10:00 am

perforce semiwiki dac 2026 600x300 2

Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure, and… Read More


Arteris at DAC 2026 Connecting Innovation for Silicon Success

Arteris at DAC 2026 Connecting Innovation for Silicon Success
by Daniel Nenni on 07-15-2026 at 6:00 am

Arteris Company banner

The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.

Silicon success is no longer determined by transistor counts alone, but by how efficiently data moves across increasingly… Read More


DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm

DAC 2026: Certus Semiconductor Brings Two New I/O Libraries to GlobalFoundries 12nm
by Daniel Nenni on 07-14-2026 at 2:00 pm

certus dac63 technical

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at Booth 839 during DAC 2026, July 27–29 in Long Beach. This year, Certus is announcing two new developments in GlobalFoundries 12LP and 12LP+ Processes: one I/O library built for commercial SoC and ASIC design teams, and one library purpose-built… Read More


DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verification

DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verification
by Daniel Nenni on 07-14-2026 at 10:00 am

SemiWiki x DAC banner

Mach42 spun out of the Department of Physics at the University of Oxford in 2019 with a mission to establish software tools capable of drastically accelerating expensive physics simulations while supporting complex computational workflows. The prototype tools were successfully applied in the emulation of extreme states … Read More