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Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
by Daniel Nenni on 02-25-2026 at 8:00 am

1 abhijeet chakraborty chiplet summit keynote 2026

At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More


An Agentic Formal Verifier. Innovation in Verification

An Agentic Formal Verifier. Innovation in Verification
by Bernard Murphy on 02-25-2026 at 6:00 am

Innovation New

In a break from our academic-centric picks, here we look at an agentic verification flow developed within a semiconductor company. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas.… Read More


Reimagining Compute in the Age of Dispersed Intelligence

Reimagining Compute in the Age of Dispersed Intelligence
by Jonah McLeod on 02-24-2026 at 10:00 am

Yuning(lr) copy

At the 2025 RISC-V Summit, amid debates over cloud scaling and AI cost, DeepComputing CEO Yuning Liang offered a radical view: the future of intelligence isn’t in the cloud at all — it’s already in your pocket. His lunchtime conversation began with iPhones and ended with the death of the operating system. In between, he sketched … Read More


Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
by Daniel Nenni on 02-24-2026 at 8:00 am

Siemens Acquires ASTER Technologies to Deliver Industry Leading PCB Test Engineering Solutions

Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More


Agentic EDA Panel Review Suggests Promise and Near-Term Guidance

Agentic EDA Panel Review Suggests Promise and Near-Term Guidance
by Bernard Murphy on 02-24-2026 at 6:00 am

Massive AI datacenter

NetApp recently hosted a webinar on Agentic AI as the future for EDA and implications for infrastructure. Good list of panelists including Mahesh Turaga (VP Cadence Cloud) with an intro preso on infrastructure and agentic AI at Cadence, then our own Dan Nenni (Mr. SemiWiki) moderating, Khaled Heloue (Fellow AMD, CAD CAD/Methodology/AI),… Read More


Hardware is the Center of the Universe (Again)

Hardware is the Center of the Universe (Again)
by Lauro Rizzatti on 02-23-2026 at 10:00 am

Hardware is the Center of the Universe (Again) Figure 1

The 40-Year Evolution of Hardware-Assisted Verification — From In-Circuit Emulation to AI-Era Full-Stack Validation

For more than a decade, Hardware-Assisted Verification platforms have been the centerpiece of the verification toolbox. Today, no serious semiconductor program reaches tapeout without emulation or FPGA-prototyping… Read More


Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine

Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
by Daniel Nenni on 02-23-2026 at 8:00 am

Easy Logic EDA

Easy-Logic Technology Ltd. is a specialized Electronic Design Automation (EDA) company focused on solving one of the most complex and time-sensitive challenges in semiconductor design: functional Engineering Change Orders (ECOs). Founded in 2014 and headquartered in Hong Kong, the company has built its reputation around

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The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years

The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years
by Mike Gianfagna on 02-23-2026 at 6:00 am

The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years

The Electronic System Design Alliance (ESDA) has been at the center of the EDA industry through its many changes over the years. It occurred to me that an update on this organization would be useful. ESDA is a technology community within SEMI and is managed primarily by a team of three who coordinate all its activities along with a … Read More


TSMC Process Simplification for Advanced Nodes

TSMC Process Simplification for Advanced Nodes
by Daniel Nenni on 02-22-2026 at 4:00 pm

TSMC Patent US10692720B2

In the modern world, the semiconductor industry stands at the heart of technological innovation. From smartphones and laptops to advanced medical devices and artificial intelligence systems, nearly every piece of contemporary electronics depends on increasingly sophisticated microchips. Among the leading companies … Read More


CEO Interview with Juniyali Nauriyal of Photonect

CEO Interview with Juniyali Nauriyal of Photonect
by Daniel Nenni on 02-22-2026 at 2:00 pm

Juniyali

Juniyali Nauriyal is the CEO and Co-Founder of Photonect, a photonics startup focused on commercializing advanced fiber-to-chip attachment technologies.  Juniyali is the co-inventor of Photonect’s core technology, which forms the foundation of the company. As CEO, she leads Photonect in translating cutting-edge photonic… Read More