Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric IntegrationThe rapid rise of artificial intelligence is fundamentally…Read More
Daniel is joined by Nir Sever, Senior Director of Business Development at proteanTecs. Nir has over 30 years of experience in advanced VLSI engineering. Before joining proteanTecs, he served for 10 years as the COO of Tehuti Networks, a pioneer in high-speed networking semiconductors. Prior to that, he served for 9 years as Senior… Read More
In the functional verification space, Breker Verification Systems stands out for its vast and long-standing understanding and ability to solve many of the seemingly intractable complexity challenges, especially in the system space.
I recently talked with Dave Kelf, Breker’s CEO, who has plenty of good news to share about Breker’s… Read More
At the recent RISC-V Now by Andes conference, Aion Silicon’s presentation made one thing clear: RISC-V is no longer an emerging alternative but rather rapidly becoming foundational to modern silicon design. This conviction is not theoretical says Oliver Jones, CEO of Aion Silicon, who gave the talk. It is grounded in Aion Silicon’s… Read More
This interview presents the first steps of Robert Simpson (R.S.), a Maths graduate who found an unexpected, but natural home in Formal Verification (FV) at Axiomise. Drawn by a desire to apply rigorous logic to real-world problems, he shares how abstract mathematical thinking translates into ensuring hardware correctness … Read More
Hardware emulation arose as a necessity out of the needs of the eighties. By the mid-1980s, semiconductor designs had outgrown the practical limits of gate-level simulation. Gate-level simulation delivered accuracy, but at glacial pace; silicon prototypes performed at real-speed but arrived far too late. The industry needed… Read More
Co-simulation, two or more simulations running concurrently in some manner, is not a new idea. I have written before about multiphysics systems able to model thermal, stress, CFD and other factors simultaneously. I just read a white paper from Siemens based on a different method, using an open standard called the Functional Mockup… Read More
A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More
Given the success of the event in Silicon Valley last week, I would expect the Siemens U2U event in Munich to be even bigger. In my experience this has been the best user driven event in 2026 with the deepest customer content. EDA has always been a customer driven industry and it is good to see us recognize that from time to time. Kalar … Read More
At the recent RISC-V Now event hosted by Andes, the discussion underscored the fact that RISC-V is no longer just about instruction set architecture advantages or customizable cores. The real focus has moved up the stack to system-level design. This is where connectivity, integration, and security define whether an innovation… Read More
The semiconductor industry is entering a new phase of complexity. Advanced nodes, heterogeneous integration, and AI-driven design workflows are placing unprecedented demands on engineering teams. While much of the focus remains on tools and methodologies, an equally critical constraint is emerging beneath the surface:… Read More
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Solving the EDA tool fragmentation crisis