Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to CompeteThe semiconductor industry is in the midst of…Read More
Reducing Risk Early: Multi-Die Design Feasibility ExplorationThe semiconductor industry is entering a new era…Read More
From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal InnovatorsCeva, Inc., a leading provider of silicon and…Read More
Functional Safety Analysis of Electronic SystemsSafety engineers, hardware designers and reliability specialists in…Read MoreAxiomise Introduces nocProve to Transform NoC Design Verification
Axiomise has recently launched a new verification tool called nocProve which will transform how Network-on-Chip designs are validated in modern hardware development, absolutely.
The tool is designed to be the first configurable formal verification application specifically created for NoC implementations. It addresses… Read More
Qnity and Silicon Catalyst Light a Path to Success at the Chiplet Summit
The Chiplet Summit recently concluded. Multi-die heterogeneous design is a hot topic these days and chiplets are a key enabler for this trend. The conference was noticeably larger this year. There were many presentations and exhibits that focused on areas such as how to design chiplets, what standards are important, how to integrate… Read More
Intel Foundry: How They Got Here and Scenarios for Improvement
How do you get a shortage while not growing???
Intel Announced earnings in January. Then David Zinsner presented updates on business this week. David is open when talking and always shares 2-3 things he probably should not share. Often he shares things some of us know, but we cannot present because it is not public. Then he makes it… Read More
The Next Hurdle AI Systems Must Clear
AI isn’t having an easy ride. The media and Wall Street swing wildly between extremes on any hint of a shift in AI sentiment. Dickens saw this coming: “It was the best of times, it was the worst of times, it was the age of wisdom, it was the age of foolishness, it was the epoch of belief, it was the epoch of incredulity, it was the season of … Read More
Why Your LLM-Generated Testbench Compiles But Doesn’t Verify: The Verification Gap Problem
By Vikash Kumar, Senior Verification Architect | Arm | IEEE Senior Member.
The Problem Every Verification Engineer Recognizes
You ask an LLM to generate a UVM testbench. It produces 25 files. Everything compiles. You run the simulation — and nothing happens. The scoreboard reports zero checks. The slave driver stops after 10… Read More
Efficient Bump and TSV Planning for Multi-Die Chip Designs
The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More
The Evolution of RISC-V and the Role of Andes Technology in Building a Global Ecosystem
During my frequent trips to Taiwan as a foundry relationship professional I remember meeting Frankwell Lin, CEO of Andes, in Taiwan 15+ years ago. As I walked to TSMC HQ from the Hotel Royal (my second home for many years) Andes was about mid point and Frankwell’s door was always open. Sometimes just tea, sometimes technology,… Read More
Operationalizing Secure Semiconductor Collaboration: Safely, Globally, and at Scale
Semiconductor manufacturing is among the most complex industrial activities in existence. As device geometries shrink and systems become more interconnected, software has become as critical as process technology itself. Modern fabs depend on extensive automation, real-time analytics, and deep integration between tools,… Read More
Keynote: On-Package Chiplet Innovations with UCIe
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More



Things From Intel 10K That Make You Go …. Hmmmm