Moore’s Law is an empirical observation stating that the number of transistors on a microchip doubles approximately every two years, leading to exponential improvements in computing performance, efficiency, and cost per function. It has been a guiding principle for the semiconductor industry for over five decades,… Read More
Anirudh Devgan is a prominent engineer, technologist, and business executive serving as the President and Chief Executive Officer (CEO) of Cadence Design Systems, a global leader in electronic design automation (EDA) and computational software. He is widely recognized for advancing machine learning, chip design… Read More
Electronic Design Automation (EDA) refers to a category of software tools and methodologies used to design, verify, and manufacture integrated circuits (ICs), systems-on-chip (SoCs), FPGAs, and printed circuit boards (PCBs). EDA enables the complex process of converting electronic system specifications into… Read More
TSMC N5 (5-nanometer process node) is a high-volume FinFET-based semiconductor manufacturing technology developed by Taiwan Semiconductor Manufacturing Company (TSMC). It succeeded the N7 (7nm) family and introduced substantial improvements in performance, power, and transistor density.
N5 is widely regarded… Read More
TSMC N3 is the 3-nanometer FinFET semiconductor manufacturing node developed by Taiwan Semiconductor Manufacturing Company (TSMC). It is a major milestone in TSMC’s process technology roadmap and represents the first step into the 3nm era, succeeding the N5 and N4 nodes.
Unlike Samsung, which introduced Gate-All-Around… Read More
Artificial Intelligence (AI) is a branch of computer science concerned with creating systems capable of performing tasks that typically require human intelligence. These tasks include learning, reasoning, problem-solving, perception, natural language understanding, and decision-making. AI spans a range… Read More
| Category | TSMC N2 | Intel 18A | Samsung 2nm (SF2) |
|---|---|---|---|
| Target Mass Production | 2H 2025 (risk production late 2024) | H2 2024 (internal); early 2025 for IFS customers | Late 2025 – risk production |
| Transistor Type | GAA nanosheet (TSMC’s implementation) | RibbonFET (Intel’s GAA design) | MBCFET™ (Multi-Bridge Channel FET) |
| Backside Power |
Also Known As: TSMC 2nm node
Developer: Taiwan Semiconductor Manufacturing Company (TSMC)
Node Class: Advanced logic semiconductor node
Technology Generation: 2 nanometer (2nm)
Status (as of 2025): Risk production in progress; volume production expected in late 2025 or 2026
The TSMC N2 process node marks a major … Read More
Full Name: Patrick Paul Gelsinger
Born: March 5, 1961
Nationality: American
Occupation: Technology Executive, Engineer, Innovator
Known For: Former CEO of Intel Corporation, Technology Leadership in Semiconductor Industry
Pat Gelsinger grew up in Pennsylvania and displayed a passion for electronics… Read More
Born: 1959, Malaysia
Nationality: American
Occupation: Entrepreneur, Engineer, Venture Capitalist, Executive
Current Positions:
CEO and Chairman of Intel Corporation (since March 2025)
Founder and Chairman of Walden International (venture capital firm)
Notable Former Roles:
CEO and Executive Chairman of Cadence Design
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Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business